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Published: 14 February 2018


The complete Advanced CMOS Essentials (ACE) Part 2 deliverable includes a concise analyst’s summary of critical device metrics, with focus on salient word line and bit line connectivity features and supported by the following analyses and image folders:

  • Large area scanning electron microscopy (SEM) image mosaic of word line and bit line areas, showing all metal levels required to extract connectivity of the array to the word line and bit line decoder regions
  • SEM image mosaics viewable in the Circuit Vision software
  • Low voltage (LV) and high voltage (HV) periphery transistor transmission electron microscopy (TEM) detail images
  • Extended materials analysis, including energy dispersive X-ray spectroscopy (EDS) and electron energy loss spectroscopy (EELS) line scan data
  • Tabular summary of key dimensions

Report Description

This product presents Part 2 of an Advanced CMOS Essentials of the SanDisk/Toshiba 64-Layer 256Gb 3D NAND flash.

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