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This report presents a Basic Functional Analysis of the Qualcomm QUA-V5AM68 die found inside the Qualcomm WCN3990 wireless combo SoC. The component was extracted from the Xiaomi Tech Xia-Mi6 multi-band handset.
This report contains the following detailed information:
Selected teardown photographs, package photographs, package X-rays, die markings, and
Scanning electron microscopy (SEM) cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
Measurements of vertical and horizontal dimensions of major microstructural features
Plan-view optical micrograph of the die delayered to the polysilicon layer
Identification of major functional blocks on a polysilicon die photograph
Table of functional block sizes and percentage die utilization
High-resolution top metal and polysilicon die photographs delivered in the ICWorks Browser
Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
This report presents a Basic Functional Analysis of the Qualcomm QUA-V5AM68 die found inside the Qualcomm WCN3990 wireless combo SoC.