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Published: 7 February 2018


This report presents a Digital Functional Analysis of the Intel\Google 8PMBCV die found inside the Intel\Google SR3HX image signal processor (ISP) component. The SR3HX was extracted from the Google Pixel 2 (model G011A) smartphone. The SR3HX chip is the result of a collaboration between Intel and Google. The report contains the following details information:

  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • Scanning electron microscopy (SEM) plan-view micrographs showing the layout of the die at the levels including, fin/shallow trench isolation (STI), gates, contacts, and minimum pitch metals
  • Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
  • Plan-view optical micrograph of the die delayered to the metal gate level
  • Identification of major functional blocks on a gate level die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and gate level die photographs delivered in the ICWorks Browser

Report Description

This report presents a Digital Functional Analysis of the Intel\Google 8PMBCV die found inside the Intel\Google SR3HX image signal processor (ISP) component. The SR3HX was extracted from the Google Pixel 2 (model G011A) smartphone. The SR3HX chip is the result of a collaboration between Intel and Google.

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