Qualcomm SDM845 Application Processor Samsung 10LPP FinFET Process Digital Functional Analysis

Product Code

FAR-1803-801

Release Date

30/05/2018

Availability

Published

Product Item Code

QUA-SDM845

Device Manufacturer

Qualcomm

Device Type

Applications Processor

Subscription

Logic

Channel

Logic - Digital Floorplan (IP)

Logic - Digital Floorplan

Qualcomm SDM845 Application Processor Samsung 10LPP FinFET Process Digital Functional Analysis

This report presents a Digital Functional Analysis of the Qualcomm HG11-P7872-2 die found inside the Qualcomm SDM845 package-on-package (PoP) component. The SDM845 was extracted from a Samsung Galaxy S9+ smartphone with the model number SM-G965U.

This report contains the following detailed information:

Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
Scanning electron microscopy (SEM) plan-view micrographs showing the layout of the die at the levels including, fin/STI, gate, contacts and minimum pitch metals
Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
Plan-view optical micrograph of the die delayered to the metal gate level
Identification of major functional blocks on a gate level die photograph
Table of functional block sizes and percentage die utilization
High-resolution top metal and gate level die photographs delivered in the ICWorks Browser

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