Product Code
FAR-1805-805
Release Date
Availability
Published
Product Item Code
QUA-QCA4020
Device Manufacturer
Qualcomm
Device Type
SoC (System-on-Chip)
Subscription
IoT Connectivity SoC
Channel
IoT Connectivity SoC - Transceiver Floorplan
Qualcomm QCA4020 Tri-Mode IoT SoC Basic Functional Analysis
This report presents a Basic Functional Analysis of the Qualcomm HG11-Y9342-100 and QCA4002 dies found inside the Qualcomm QCA4020 package. The Qualcomm QCA4020 package was extracted from the Qualcomm 65-YA999-1 product development kit.

This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
  • Measurements of vertical and horizontal dimensions of major microstructural features
  • Plan-view optical micrograph of the die delayered to the polysilicon layer
  • Identification of major functional blocks on a polysilicon die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and polysilicon die photographs delivered in the ICWorks Browser
  • Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
 

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