This report presents a Basic Functional Analysis of the Broadcom BCM15900 die found inside the Broadcom BCM15900B0-KWFBG package.

This report contains the following detailed information:

• Selected teardown photographs, package photographs, package X-rays, die markings, and diephotographs
• SEM cross-sectional micrographs of the general structure of the die dielectric materials, majorfeatures, and transistors
• Measurements of vertical and horizontal dimensions of major microstructural features
• Plan-view optical micrograph of the die delayered to the polysilicon layer
• Identification of major functional blocks on a polysilicon die photograph
• Table of functional block sizes and percentage die utilization
• High-resolution top metal and polysilicon die photographs delivered in the ICWorks Browser
• Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process