Winbond 31 nm 2D NAND DAG062 Die Memory Floorplan Analysis

Product Code

MFR-2009-802

Release Date

17/12/2020

Availability

Published

Product Item Code

WIN-W29N02KVBIAF

Device Manufacturer

Winbond

Device Type

Flash

Subscription

Memory - NAND & DRAM

Channel

Memory - NAND Floorplan Analysis

Winbond 31 nm 2D NAND DAG062 Die Memory Floorplan Analysis

This report presents a Memory Floorplan Analysis of the Winbond DAG062 die found inside Winbond W29N02KVBIAF component.
This report contains the following detailed information:

Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
Scanning electron microscopy (SEM) cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
Plan-view SEM micrograph of the memory array delayered to active, WL, and BL layers
Measurements of vertical and horizontal dimensions of major microstructural features
Plan-view optical micrograph of the die delayered to the polysilicon layer
Identification of major functional blocks on a polysilicon die photograph
Table of functional block sizes and percentage die utilization
High-resolution top metal and polysilicon die photographs delivered in CircuitVision
Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process

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