Product Code
DFR-2107-802
Release Date
Availability
Published
Product Item Code
QUA-SM7350
Device Manufacturer
Qualcomm
Device Type
SoC (System-on-Chip)
Qualcomm SM7350 Snapdragon 780G Digital Floorplan Analysis
This field is used for the Long Desc for the Report Store Item in the eStore.This report presents a Digital Floorplan Analysis of the 2V0-110000000-00 die found inside the 215-110000066 graphics processing unit (GPU) component. The 215-110000066 package was extracted from the AMD Instinct MI100 graphics card.

This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • Scanning electron microscopy (SEM) plan-view micrographs showing the layout of the die at levels including fin/shallow trench isolation (STI), gate, contacts, and minimum pitch metals
  • Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
  • Plan-view optical micrograph of the die delayered to the metal gate level
  • Identification of major functional blocks on a gate level die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and gate level die photographs delivered in the CircuitVision software
  • Cost of die based on the manufacturing cost analysis of the observed process
 

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