This report presents a package analysis (PKG) of the OmniVision OS12D40 chip-scale package from the Reolink RLC-810A IP camera. The OS12D40 is an 11.3 MP class imager targeting security camera applications. The imager is packaged using a 108-pin fan-out package strategy.
The PKG includes observed device metrics and salient features supported by the following unannotated image folders:

• Package photographs and X-ray images
• Die photographs
• Optical and SEM package cross-section photographs
• SEM-EDS spectra of selected package materials

The image set for a PKG project is derived from a package cross sectional analysis, supplemented by jet etch decapsulation, when applicable. Value added information, such as additional planes of cross-sectioning, may be included on a case-by-case basis. The PKG deliverable provides competitive benchmarking information and enables cost-effective tracking of multiple competitors' technology.