Qualcomm HB07D ultraBAW SMR die (QPM6670-000) Acoustic Wave Filter Report
Explore our in-depth analysis of Qualcomm’s SMR ultraBAW filter die HB07D, featuring TDK's Thin Film Acoustic Package (TFAP). Essential insights for RF filter designers, manufacturers, and the RF IC supply chain.
The design and manufacturing of Qualcomm’s SMR type ultaBAW filter die HB07D, extracted from the QPM6670 MHB L-PAMiD front-end module, is analyzed in this report. The thin film acoustic package (TFAP) developed by TDK and now incorporated into several of Qualcomm’s acoustic filter components, is a critical innovation we cover in the analysis of this solidly mounted resonator (SMR) BAW filter.
The structure and material information in this report is of interest to RF FE, RF filter design and manufacture designers, equipment suppliers, and all parties linked to the RF IC supply chain.
