The Intel SRK02 Corei7-1165G7 (Tiger Lake)was built on 300 mm wafers using Intel’s third generation 10 nm finFET HKMG CMOS process. The complete ACE deliverable includes a concise analysis summary report of critical device metrics, transmission electron microscopy (TEM) based energy dispersive X-ray spectroscopy (TEM-EDS) results, and salient features supported by the following image folders:
- Downstream product teardown
- Package X-rays, top metal and poly die photographs
- Transmission (TEM) and (SEM) bevel through the logic region and SRAM
- SEM cross section of the general device structure, metals, dielectrics, and detail of the FEOL structures