Beken BK3296 22nm Bluetooth Audio SoC Process Analysis
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This report provides an analysis of the structure and materials used in the manufacture of Beken BK3296 22nm Bluetooth Audio SoC manufactured in UMC's 22nm ULP process. The report includes a summary of key findings, and a detailed look at the FEOL, MOL and BEOL structures and materials used. Extensive SEM, TEM and materials analysis provide a complete look at how this device was manufactured.
