Automotive
TechInsights equips you with the insights you need to successfully navigate the automotive semiconductor market.
Light vehicle production and semiconductor demand have historically grown at a similar rate – until recently. TechInsights is currently forecasting a steep upswing in semiconductor demand, surpassing the growth trajectory of vehicle production as we look ahead to the future.
Your Automotive Solutions
Through TechInsights, Platform members have the opportunity to subscribe to automotive solutions and multiple add-ons all in one place.
ADAS/ Autonomous
Optimize production and reduce costs by leveraging market data on automotive electronics. Utilize insights on 100+ systems to optimize production schedules and cut inventory costs.
Advanced packaging
Advanced packaging provides deep technical analysis for Logic, Power, and Image Sensors combined with market outlooks, forecasts, and structure of advanced packaging techniques including Chiplets.
Connectivity
Optimize signal integrity for in-vehicle device connectivity with visibility into how competitive wireless transceivers support the latest protocol versions with their technology and design choices.
EV
Align manufacturing capacities with projected demand for key electric vehicle components like battery management systems and main inverters, avoiding overproduction or shortages.
Image Sensor
De-risk and support product roadmaps and decisions with insight into circuit design strategies, manufacturing processes, and trends across key players in the image sensor market.
Infotainment
Craft compelling in-vehicle experiences for next-gen vehicles with our consumer research covering connectivity, safety, and more.
Logic
Ensure SoC designs stay ahead by adopting cutting-edge trends and approaches, supporting your product, design, and foundry partner teams.
Automotive
Executive Insights
Stay ahead in the automotive sector with our concise insights on global economic trends and semiconductor industry forecasts.
Power
Support strategic planning and development with insight into power semiconductor technologies choices and strategies of competitors.
Add-on Solutions
Add-on solutions provide supplementary features and functionalities, enhancing the capabilities of the core TechInsights product or service.
Semiconductor Manufacturing Economics
Supply relationship and activity databases for semiconductor growth areas and detailed volume forecasts for chips in automotive and consumer electronics markets.
BOM Database and BOM Database with Subsystems
TechInsights' BOM costing and design wins database contains three decades of accumulated semiconductor data from our Teardown analysis of consumer electronics products.
Component Price Landscape
(CPL)
Leading index for tracking 140+ commodity EE component categories and 50,000+ MPNs, aiding purchasing decisions.
Semiconductor Market Analysis by Technology
Market forecasts, market share, technology roadmaps, and supply chain signaling for all major technologies including compute, sensors/image, analog/RF, power, memory and SoC.
Semiconductor Manufacturing Carbon Model
Detailed, bottom-up analytics around carbon emissions including company and fabrication specific process and facility calculations, models training edge, current and projected 300mm processes, and more.
Component Price Analyzer (CPA)
The CPA tool examines the Bill of Materials (BOMs) for individual customers in the field of electrical engineering. CPA compares the prices of components provided by the customers with the average market prices based on their purchase volume.
Semiconductor Market Analysis by End Market
Market forecasts, market share, technology roadmaps, and supply chain signaling for all major companies and end markets across mobile, cloud/datacenter, AI, automotive, and more.
Manufacturing Insights
Get visibility into the semiconductor supply chain so you can optimize production planning and increase quality assurance. Gain a competitive advantage by making data-driven decisions, accelerating time to market, and fostering innovation when it comes to product development.
Expand Your Automotive Solutions
Use data-driven analysis and market insights pertaining to the global automotive electronics market to determine essential vehicle features and technologies to integrate into your product roadmaps. With comprehensive coverage of more than 100 automotive electronics systems and their resulting semiconductor and sensor demand, you can effectively strategize production schedules and mitigate excess inventory costs.
Offering
What's included
TechInsights’ Autonomous Vehicles coverage offers forecasts and analysis both of today’s ADAS technologies as well as an expert, independent view on what the future of automated driving will bring, and where the resulting opportunities will lie. It includes deep coverage at the system, semiconductor and sensor levels, as well as a broad view of whole value chain.
- Competitor Analysis
- Market Data
- Insight Reports
- Demand Forecasts
- Supply Analysis
- Inquiry Privileges
- Dashboard Access
Powertrain Body Chassis Safety
TechInsights’ Powertrain, Body, Chassis and Safety is the industry’s premier source of market information on the complex global automotive electronics market. It covers over 100 different automotive electronics systems, including the resulting semiconductor and sensor demand. It also assesses the impact of vehicle architecture change on the automotive ecosystem.
- Competitor Analysis
- Market Data
- Insight Reports
- Demand Forecasts
- Supply Analysis
- Inquiry Privileges
- Dashboard Access
In-Vehicle UX gives you instant access to our extensive consumer research and analysis of the latest trends impacting the automotive user experience.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Dashboard Access
ADAS Controller Teardown provides curated data with technical insight on ADAS to reveal design wins and provide valuable context on how individual components contribute to the larger picture. They include: ICs identification and costing, reports containing pictures of circuit boards with annotated ICs, major sub-assemblies and antennas, die photos for major ICs and tables for features descriptions and dimensional data, costed bill of materials (BOM) spreadsheets, RF block diagrams, system block diagrams.
- Competitor Analysis
- Market Data
- Insight Reports
- Inquiry Privileges
- Dashboard Access
- Cost Analysis
- Block Diagram
- Product Features
- High Resolution Images
ADAS Design Material & Assembly
ADAS Design Material and Assembly provides detailed teardown photos and annotations describing assembly techniques, material function, material composition, IC selection and mechanical features of modules to help OEMs reach mass market deployments quickly and cost-effectively. It also includes:
- Isometric views of the products with dimensions and callouts of major mechanical or other visible features contributing to specific functions
- Images of subassemblies and their major components
- Weights and dimensional attributes of key components
- Materials, fabrication processes, assembly processes and features, PCB dimensions and fabrication details*
- Surface treatments*
- Thermal solutions
- Environmental/EMI (electromagnetic interference) and EMC (electromagnetic compatibility) seals
- IC selection
* = Where identifiable
- Competitor Analysis
- Market Data
- Insight Reports
- Inquiry Privileges
- Dashboard Access
- Cost Analysis
- Block Diagram
- Product Features
- High Resolution Images
TechInsights’ Automotive Connected Mobility covers all key aspects of car subscriptions, Mobility as a Service, car sharing, and ride hailing. It includes analysis of the regulatory environment, OEM strategies, business models, user experiences, and financial performance of public and private entities in these markets. Our analysis helps you understand current market trends and what the implications of them are for your company. Our analysts help you unpack the numbers to give you a competitive advantage.
- Competitor Analysis
- Market Data
- Insight Reports
- Demand Forecasts
- Inquiry Privileges
- Dashboard Access
- Cost Analysis
- Block Diagram
- Product Features
- High Resolution Images
Advanced packaging provides deep technical analysis for Logic, Power, and Image Sensors combined with market outlooks, forecasts, and structure of advanced packaging techniques including Chiplets.
Offering
What's included
TechInsights' Packaging coverage helps you understand all aspects of advanced logic technologies, gain visibility into the competition’s historical – and anticipated – approach, and make better next-node technology choices.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Dashboard Access
- Packaging
TechInsights' CMRS Forecast Pro provides critical datasets for semiconductors, silicon, packaging, designs and reticles along with semiconductor inventories, capacity and supply-demand analysis.
- Market Data
- Demand Forecasts
- Inquiry Privileges
- Dashboard Access
Enables the comparison of various RFIC advanced packaging implementations to gain a better understanding of how they impact RF system design. This includes aspects such as DC and RF performance pertaining to module packaging, size and thermals, and heterogeneous integration. Analysis includes SEM cross-sectional and EDS materials analyses.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Packaging
Our Chiplets coverage tracks usage across 33 end markets and provides a breakdown of chip market research total addressable market (TAM) split between monolithic and chiplet, enabling customers to better understand the market opportunity for advanced packaging alternatives such as chiplets and to better target the highest potential TAM opportunities.
- Competitor Analysis
- Market Data
- Demand Forecasts
- Supply Analysis
- Inquiry Privileges
- Cost Analysis
- Block Diagram
- Product Features
- EE Component Usage Across Products
- Component Prices
For Fabless, IDM Semiconductor, IP vendors, and Foundries, SoC Markets explains how to optimize design costs for intricate SoCs. Understanding which chip designs and applications are driving market growth allow these companies to validate licensing and royalty revenues. With Reverse Engineering, market presence and technical performance are verified with continuous finetuning of existing models.
- Competitor Analysis
- Market Data
- Insight Reports
- Demand Forecasts
- Supply Analysis
- Inquiry Privileges
- Dashboard Access
- Cost Analysis
- Block Diagram
- Product Features
TechInsights' Device Essentials provides broad coverage of the enabling technologies and pixel architectures in use in array imagers, time-of-flight (ToF), event-driven, biometric, and other optical sensors. Tactical reporting on new solutions as they come to market is augmented by curated analyst content.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Packaging
- Process
Power Essentials (GaN, SiC, Si)
TechInsights' Power Essentials provides in-depth process analysis for GaN, SiC, and Si power devices, and comprehensive coverage of device metrics and salient features. Analysis includes detailed structural and material analysis using techniques such as SEM, TEM, and SCM/sMIM, covering package and die images/X-rays, SEM planview and cross-sectional images with annotated SEM-EDS material analysis conclusions, and cross-sectional TEM images with annotated TEM-EDS/EELS analysis conclusions for GaN devices, cross-sectional and planar SCM (sMIM) analysis for Si and SiC.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Process
Optimize signal integrity for in-vehicle device connectivity with visibility into how competitive wireless transceivers support the latest protocol versions with their technology and design choices.
Offering
What's included
IoT Connectivity SoC: RF Architecture
TechInsights' IoT Connectivity SoC Transceiver Architecture coverage enables a better comparison and understanding of how design constraints and challenges are addressed for leading-edge IoT transceiver chipsets in smart home products, wearables, and routers across market leaders and disruptors over major wireless standards such as Bluetooth, Wi-Fi, NFC, UWB, and more. It includes and extends Transceiver Floorplan analyses to identify key functional blocks and the connections between them.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Circuit
IoT Connectivity SoC: Basic Floorplan
TechInsights' IoT Connectivity SoC Transceiver Floorplan provides insight into competitive designs including high-level block identification, high-level process data, and manufacturing costs for leading-edge transceivers in smart home products, wearables, and routers across market leaders and disruptors over major wireless standards such as Bluetooth, Wi-Fi, NFC, UWB, and more.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- IC Floorplan
TechInsights' Transceiver Architecture enables a better comparison and understanding of how design constraints and challenges are addressed for leading-edge 5G and FR2 transceivers. It includes and builds on the Transceiver Floorplan content to identify key functional blocks and the connections between them.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Circuit
TechInsights' Transceiver Floorplan provides insight into competitive designs including high level block identification, high level process data and manufacturing costs for leading-edge 5G and FR2 transceivers in flagship handsets across market leaders and disruptors.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- IC Floorplan
Use projections for system demand in critical electric vehicle components, such as battery management systems and main inverters, to align manufacturing capacities with expected demand, preventing overproduction or shortages. With our thorough examination of market trends in electric vehicle battery technology and insights into successful competitor designs, you can develop battery management systems, semiconductors, and sensors tailored to meet the specific needs of your target end users.
Offering
What's included
TechInsights’ Electric Vehicles coverage offers forecasts and analysis of the rapidly-growing and strategically vital electric vehicle market. It offers deep analyses at the system, semiconductor, and sensor levels, as well as a broad view of the whole value chain, along with valuable insights covering global and regional regulatory and policy dynamics, OEM strategies, emerging technologies, and economies.
- Competitor Analysis
- Market Data
- Insight Reports
- Demand Forecasts
- Supply Analysis
- Inquiry Privileges
- Dashboard Access
In-Vehicle UX gives you instant access to our extensive consumer research and analysis of the latest trends impacting the automotive user experience.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Dashboard Access
TechInsights' Battery Cell Essentials profiles the innovations impacting battery life extension, energy density, safety, cost reduction, charging speed, etc. The analysis includes materials and structural analysis (anode, cathode, electrolyte, and separator) of innovative lithium-ion battery cells found in phones, wearables, laptops, tablets, pens, and more. The analysis will also show details of the battery pack, its fit in the source device, and the components found on the battery protection control module.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Process
TechInsights' Battery Characterization covers cells from a range of market applications, with a focus on mobile and smaller (wearables, pens, etc.) form-factors from leading OEMs. The analysis provides insight into the thermal characteristics of devices during wireless and wired charging as well as lithium-ion battery performance during operation over a range of different conditions.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Systems
De-risk and support product roadmaps and decisions with insight into circuit design strategies, manufacturing processes, and trends across key players in the image sensor market.
Offering
What's included
Camera Teardown provides curated data with technical insight on cameras to reveal design wins and provide valuable context on how individual components contribute to the larger picture. They include:
- ICs identification and costing
- Reports containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas
- Die photos for major ICs and tables for feature descriptions and dimensional data
- Costed bill of materials (BOM) spreadsheets
- RF block diagrams
- System block diagrams
- Competitor Analysis
- Market Data
- Insight Reports
- Inquiry Privileges
- Dashboard Access
- Cost Analysis
- Block Diagram
- Product Features
- High Resolution Images
LiDAR Design Material & Assembly
LiDAR Design Material and Assembly provides detailed teardown photos and annotations describing assembly techniques, material function, material composition, IC selection and mechanical features of modules to help OEMs reach mass market deployments quickly and cost-effectively.
- Competitor Analysis
- Market Data
- Insight Reports
- Inquiry Privileges
- Dashboard Access
- Cost Analysis
- Block Diagram
- Product Features
- High Resolution Images
LiDAR Teardown provides curated data with technical insight on LiDAR to reveal design wins and provides valuable context how individual components contribute to the larger picture. They include:
- ICs identification and costing
- Report containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas
- Die photos for major ICs and tables for features description and dimensional data
- Costed bill of materials (BOM) spreadsheet
- RF block diagram
- System block diagrams
- Competitor Analysis
- Market Data
- Insight Reports
- Inquiry Privileges
- Dashboard Access
- Cost Analysis
- Block Diagram
- Product Features
- High Resolution Images
TechInsights' Circuit Analysis includes hierarchical schematics, delivered in a highly interactive, easy-to-navigate environment including cross-probing to layout capability, of the active pixels, column readout, ADC, row control, ramp generator, and bandgap.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Circuit
TechInsights' Device Essentials provides broad coverage of the enabling technologies and pixel architectures in use in array imagers, time-of-flight (ToF), event-driven, biometric, and other optical sensors. Tactical reporting on new solutions as they come to market is augmented by curated analyst content.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Packaging
- Process
TechInsights' Image Signal Processor content provides insights into the functional blocks and die utilization of stacked and standalone image signal processors. This content provides floorplan (functional) analysis of image signal processors (ISP) in applications such as smartphone, automotive imaging and optical sensing, computer/machine vision, edge AI, IoT, LiDAR, security/ surveillance, and more.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- IC Floorplan
Using our extensive consumer research on cutting-edge connectivity, infotainment and telematics, advanced safety, electrification, and mobility technologies for in-vehicle user experiences, you can design compelling experiences for customers of your next-gen vehicles. With in-depth evaluations and recommendations for design, consumer needs, and customer willingness to pay, you'll be well-equipped to address driver and passenger requirements by developing in-vehicle solutions that are not only useful, but also usable, compelling, and safe.
Offering
What's included
TechInsights’ Automotive Infotainment and Telematics covers all key aspects of in-vehicle infotainment, wireless communication, and connectivity adoption in the connected car. It includes detailed semiconductor and system market sizing, including unit, revenues and ASPs, along with granular Tier 1 and semiconductor supplier market shares. It also looks at software trends, including OS usage, and OTA implementations.
- Competitor Analysis
- Market Data
- Insight Reports
- Demand Forecasts
- Supply Analysis
- Inquiry Privileges
- Dashboard Access
In-Vehicle UX gives you instant access to our extensive consumer research and analysis of the latest trends impacting the automotive user experience.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Dashboard Access
Audio Amplifier Teardown provides curated data with technical insight on audio amplifiers to reveal design wins and provides valuable context on how individual components contribute to the larger picture. They include:
- ICs identification and costing
- Report containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas
- Die photos for major ICs and tables for features description and dimensional data
- Costed bill of materials (BOM) spreadsheet
- RF block diagram
- System block diagrams
- Competitor Analysis
- Market Data
- Insight Reports
- Inquiry Privileges
- Dashboard Access
- Cost Analysis
- Block Diagram
- Product Features
- High Resolution Images
Infotainment Teardown provides curated data with technical insight on infotainment to reveal design wins and provides valuable context how individual components contribute to the larger picture. They include:
- ICs identification and costing
- Report containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas
- Die photos for major ICs and tables for features description and dimensional data
- Costed bill of materials (BOM) spreadsheet
- RF block diagram
- System block diagrams
- Competitor Analysis
- Market Data
- Insight Reports
- Inquiry Privileges
- Dashboard Access
- Cost Analysis
- Block Diagram
- Product Features
- High Resolution Images
Choose the best technology supplier that meets automotive requirements with awareness of the latest SoC developments and comparisons, design wins and AI advancements. With our reverse engineering insights coupled with our design start insights, you can align your plans to better compete in the market.
Offering
What's included
AI Processor content covers hardware technologies and products from leading AI companies. It provides deep technology analysis and head-to-head product comparisons, as well as analysis of company prospects in this rapidly developing market segment. We explain which products will win designs and why. TechInsights’ AI Processor content provides a forward-looking view, helping sort through competing claims and products.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Cost Analysis
- Block Diagram
- Product Features
- High Resolution Images
- Comp Price and Lead-Time Trends
TechInsights' Digital Floorplan is a high-level view of SoC design quality, focusing on leading-edge APU, CPU, GPU, AI accelerator, FPGA, baseband / connectivity, VPU, advanced MCU components, plus emerging applications such as AR and vision processing SoCs.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Dashboard Access
- IC Floorplan
Understand the automotive sector status and risks quickly with our candid insights on global economic and business conditions, trends, and outlooks impacting the semiconductor industry to help you stay on top of market developments. With validated demand data, forecasts, and industry insights, you can align your plans to better compete in the market.
Offering
What's included
Microprocessor Report Enterprise License
This industry-leading weekly journal covers new Microprocessors and SoCs, providing insight into their target application and market, and differentiation from their competitive products. This will expand your access to more of the information you need to compete globally and enhance your ability to make fact-based decisions that will impact your business faster and more effectively.
The Chip Insider is a go-to resource for senior semiconductor executives. It provides straightforward reports on current industry issues, trends, strategies, and tactics. Get insider insights on supplier-customer dynamics, corporate strategies, industry trends, challenges, projections, and historical facts, presented in a clear and informative manner.
- Insight Reports
- Inquiry Privileges
TechInsights' TCI Graphics content provides a unique view into the health of the semiconductors manufacturing ecosystem, including key performance indicators across electronics, semiconductors, and equipment supply chains with simple charts to communicate changes in the market with weekly and monthly views.
- ICs identification and costing
- Report containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas
- Die photos for major ICs and tables for features description and dimensional data
- Costed bill of materials (BOM) spreadsheet
- RF block diagram
- System block diagrams
The McClean Report helps you identify how to better position your business to be competitive. You don’t have to be an expert in semiconductors to understand the broad variety of analyses and perspectives, and how The McClean Report can complement your business, and your business decision-making – not only from the technical or legal point of view but also from the geopolitical, and regional market(s) angle.
- Insight Reports
- Inquiry Privileges
Semiconductor Analytics provides weekly data visualization on semiconductor supply and demand analysis, and provides granular level sales per week and allows for quarterly and yearly comparisons.
- Competitor Analysis
- Market Data
- Insight Reports
- Demand Forecasts
- Supply Analysis
- Inquiry Privileges
- Dashboard Access
Powertrain Body Chassis Safety
TechInsights’ Powertrain, Body, Chassis and Safety is the industry’s premier source of market information on the complex global automotive electronics market. It covers over 100 different automotive electronics systems, including the resulting semiconductor and sensor demands. It also assesses the impact of vehicle architecture changes on the automotive ecosystem.
- Competitor Analysis
- Market Data
- Insight Reports
- Demand Forecasts
- Supply Analysis
- Inquiry Privileges
- Dashboard Access
Support strategic planning and development with insight into power semiconductor technologies choices and strategies of competitors.
Offering
What's included
Power Essentials (Process - GaN, SiC, Si)
TechInsights' Power Essentials provides in-depth process analysis for GaN, SiC, and Si power devices, and comprehensive coverage of device metrics and salient features. Analysis includes detailed structural and material analysis using techniques such as SEM, TEM, and SCM/sMIM, covering package and die images/X-rays, SEM Planview and cross-sectional images with annotated SEM-EDS material analysis conclusions, and cross-sectional TEM images with annotated TEM-EDS/EELS analysis conclusions for GaN devices, cross-sectional and planar SCM (sMIM) analysis for Si and SiC.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Process
Silicon Carbide (SiC) & Gallium Nitride (GaN) Process Flow
TechInsights' Silicon Carbide (SiC) & Gallium Nitride (GaN) Process Flow provides in-depth process flow analysis detailing the manufacturing steps to fabricate innovative SiC power devices from wafer-in to wafer-out. Analysis includes process architecture, mask list, and integration-level process steps, layout (.GDS) decomposed into process layers, and emulated device structure, tool type as well as design rules, layer dimensions, and process assumptions.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Process Flow
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