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    Intel 10 nm Logic Process Analysis (Cannon Lake)
    June 12, 2018

    Intel 10 nm Logic Process Analysis (Cannon Lake)

    TechInsights has found the long-awaited Cannon Lake - the Intel 10 nm logic process inside the i3-8121U CPU, used in the Lenovo IdeaPad330.

    SK hynix 72L 3D NAND Analysis
    May 31, 2018

    SK hynix 72L 3D NAND Analysis

    SK hynix claims to have created the industry’s first-ever 72-layer 256Gb 3D NAND flash. This innovation is based on triple-level cell technology (TLC), it has a block size 50% larger compared to 48-layer 3D TLC chips, and it has a lower programming time (tPROG).

    Micron 1x DDR Analysis
    May 14, 2018

    Micron 1x DDR Analysis

    TechInsights has found the Micron 1x process in the Micron DIMM (DDR4) and Huawei Mate 10 (LPDDR4).

    Featured Reports

    Samsung S5K2X7SP 0.9µm Image Sensor
    March 8, 2018

    Samsung S5K2X7SP 0.9µm Image Sensor

    Learn more about what reports we have available and planned for this part.

    Samsung 64L 3D V-NAND
    January 17, 2018

    Samsung 64L 3D V-NAND

    Samsung released their 64L 3D V-NAND solution in January of 2017 for key IT customers, and ramped up production in June for its expanded general market.

    Toshiba 64L NAND – BiCS FLASH
    January 17, 2018

    Toshiba 64L NAND – BiCS FLASH

    Toshiba released their 64L NAND solution (BiCS FLASH) in a SanDisk Ultra 3d SSD in 2017. TechInsights has conducted a significant amount of analysis on this product.

     
    Samsung 18 nm DRAM Analysis
    December 15, 2017

    Samsung 18 nm DRAM Analysis

    TechInsights published our first in a series of reports on this innovation that provides a memory density increase of 32.8% when comparing 8Gb DRAM 18 nm and 20 nm die.

    Intel/Micron 64L 3D NAND Analysis
    November 9, 2017

    Intel/Micron 64L 3D NAND Analysis

    The Intel 545S SSD, introduced in June 2017, was the first product to include the Intel/Micron 64L 3D NAND, and one of the first SSD to use 64L.

    TSMC 10 nm Process
    July 26, 2017

    TSMC 10 nm Process

    TSMC 10 nm was found in the Apple A10X processor (APL1071) found in the Apple iPad Pro 10.5 (MQDT2CL/A).

     
    Intel 3D XPoint
    May 16, 2017

    Intel 3D XPoint

    3D XPoint technology was unveiled by Intel and Micron in August 2015, creating the first new memory category in more than 25 years.

    Sony IMX400 3-Layer Stacked (Exmor RS) CMOS Image Sensor
    May 11, 2017

    Sony IMX400 3-Layer Stacked (Exmor RS) CMOS Image Sensor

    Sony Mobile announced the Xperia XZs at Mobile World Congress in February 2017. The Xperia XZs features a 1/2.3-inch optical format, 19 Mp resolution, Exmor RS “Motion Eye” camera offering with 960 fps video and predictive capture.

    Samsung 10 nm LPE Process
    April 26, 2017

    Samsung 10 nm LPE Process

    The Qualcomm Snapdragon 835 applications processor found in the Samsung Galaxy S8 is confirmed to be built on Samsung’s 10 nm LPE process.

     
    Qualcomm WTR5975 Gigabit LTE Transceiver
    April 20, 2017

    Qualcomm WTR5975 Gigabit LTE Transceiver

    The WTR5975 is a member of the Snapdragon 835 family found in the Samsung Galaxy S8 and is the world’s first single-chip RF IC supporting Gigabit Class LTE, LTE-U, and LAA with 5 GHz unlicensed band support.

    Apple W1 343S00131 Bluetooth Module
    January 20, 2017

    Apple W1 343S00131 Bluetooth Module

    The W1 chip found in the Beats Studio wireless headphone has the package mark 343S00131. Meanwhile, the W1 chip torn down from the Apple AirPods has the package mark 343S00130.

     
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