Interested in this report?

Published: 11 May 2018

The Device Essentials deliverable for imaging devices includes a one page summary of observed device metrics and salient features. The summary is supported by the following unannotated image folders:

  • Downstream product teardown
  • Package X-rays, die photograph, non-invasive optical photos of die features
  • SEM imaging of the pixel array delayered to the metal, transistor, and diffusion levels
  • Exploratory cross-section SEM imaging of the general pixel array and peripheral structures
This deliverable provides basic competitive benchmarking information and enables cost-effective tracking of multiple competitors’ technology.

Report Description

Device Essentials Image Set and Summary

Recent OMR Reports

FAR-1808-802  |   Published: 19 September 2018
This report presents a Basic Functional Analysis of the Intel 82574 die found inside Intel WCS9200 package. The Intel WCS9200 package was extracted from the Rivet Networks Killer wireless-AC 1550 Wi-Fi...
FAR-1808-901  |   Published: 19 September 2018
This report presents a basic Functional Analysis of the Broadcom BCM4775 dual-frequency GNSS die found inside Broadcom BCM47755KUB1G package. This report contains the following detailed information:...
DEF-1807-802  |   Published: 17 September 2018
The Device Essentials deliverable for imaging devices includes a one page summary of observed device metrics and salient features. The summary is supported by the following unannotated image folders: ...