Update brings more fabs, water use, increased technology coverage to TechInsights Semiconductor Manufacturing Carbon Model
By Gibson Peters
TechInsights released its latest update of the Semiconductor Manufacturing Carbon Model on Earth Day 2024 (April 22, 2024), providing major enhancements to a sustainability tool aimed at providing users with more accurate calculations of carbon emissions.
Notable improvements include the expansion of fab coverage, with the model now covering 184 300mm semiconductor fabs worldwide. Major semiconductor companies such as Intel, Samsung, Micron, Global Foundries and TSMC are among those covered.
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Technology coverage has widened from 130nm to 10A, encompassing both logic and memory technologies (NAND and DRAM).
Users can now access semiconductor carbon emissions data at the die level and insights into water usage by die and wafer.
Understanding equipment-level emissions is facilitated through detailed breakdowns of gas, carbon, and electricity usage across various equipment categories such as Equipment categories: atomic layer deposition (ALD), chemical vapor deposition (CMP), chemical vapor deposition (CVD), dry etch, implant, inspection, lithography, metrology, plating, physical vapor deposition (PVD), spin-on, thermal and wet cleans. The model makes it possible to review and compare electricity, carbon emissions, and process gases for each piece of equipment used.
With these updates, users can delve into and model detailed assumptions regarding process throughput, steps per process, and materials used. The model provides semiconductor carbon emissions from 2015 to 2035 allowing users to compare historical results to current and future scenarios.
The Semiconductor Manufacturing Carbon Model calculates Scope 1 and 2 carbon emissions from IC die manufacturing and silicon wafers in the 130nm to 10A range. Scope 1 emissions are further broken down by natural gas and individual process gases.
The Carbon Model provides detailed modeling and benchmarking that foundries, fabless, capital equipment manufacturers, product manufacturers, and IDMs (integrated die manufacturers) need to inform key sustainability initiatives and long-term decisions and that they need to evaluate to reduce their carbon emissions. And now the tool has even broader coverage, additional data, and greater value for customers.
The sustainability team is also working on a carbon model for semiconductor packaging. The team is also working on adding Scope 3 material emissions to both the Semiconductor Manufacturing Carbon Model and the Semiconductor Packaging Carbon model. These enhancements will be released in the near future.
For a video walkthrough of some of the Semiconductor Manufacturing Carbon Model’s latest features, visit the TechInsights Platform.
