Realtek RTL8763EWE BT 5.3 LE Audio SoC Floorplan Analysis

Realtek RTL8763EWE BT 5.3 LE Audio SoC Floorplan Analysis

Analysis of the Realtek RL6736B die, found in the RTL8763EWE Bluetooth Audio SoC from the MEVADEN H32 smartwatch, a key device for IoT connectivity.

This report presents a Basic Floorplan Analysis of the Realtek RL6736B die found inside the Realtek RTL8763EWE component. The RTL8763EWE device competes against similar products from MediaTek, Qualcomm, and Broadcom.

This report comprises selective teardown photographs of the downstream product and the analyzed device. Optical imaging and cross-sectional scanning electron micrographs for the target die are provided for insights into process technology details. Also, a functional block analysis of the die is conducted, and costing analysis of the die is included.

Technology areas and application domains for wireless connectivity that TechInsights is surveying and analyzing (of which this class of SoC is a part) are listed in the IoT connectivity Technology Roadmap.

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