December 28, 2020 Dick James Intel Launches 2nd-Gen 3D XPoint Memory, Discusses at IEDM On Dec 16th Intel held a " Memory & Storage Moment "" where they announced five new memory and storage products; two Optane™ SSDs, one for data centers, and one aimed at PCs, and three 144-layer 3D-NAND SSDs

December 21, 2020 Stephen Russell Toshiba Integrated Diode into SiC MOSFET Every silicon carbide (SiC) manufacturer seemingly has their own approach to FET fabrication. Be it planar, trench, JFET, etc. there is no dominant design throughout the market. Toshiba’s recently released 2nd generation 1200

Dick James, Fellow Emeritus Dick James is an almost 50-year veteran of the semiconductor industry, working in the process development, design, manufacturing, packaging and reverse engineering of semiconductor devices. Dick is a regular contributor to TechStream blog content for subscribers. December

Available Logic Subscriptions > Process & Advanced Packaging > Process Flows > Transistor Characterization > SoC Design Analysis > Digital Floorplan Analysis > Analytics - Digital Floorplan > Standard Cell GDS Library Analysis > Transistor Architecture Comparison > Interconnect and Patterning

Stacy Wegner, Senior Technology Analyst Stacy Wegner is the Senior Technology Analyst of TechInsights’ Teardown division, responsible for ensuring the highly technical data produced by our analysts is transformed into consumable competitive intelligence. Stacy has an extensive background in advanced

Sinjin Dixon-Warren, Senior Process Analyst Sinjin Dixon-Warren is a Senior Process Analyst at TechInsights with over 20 years of experience with semiconductor analysis and is a Subject Matter Expert (SME) for Power Electronics Analysis. He holds a PhD in chemical physics from the University of

Stacy Wegner, Senior Technology Analyst Stacy Wegner is the Senior Technology Analyst of TechInsights’ Teardown division, responsible for ensuring the highly technical data produced by our analysts is transformed into consumable competitive intelligence. Stacy has an extensive background in advanced

Jeongdong Choe, Senior Technical Fellow Dr. Jeongdong Choe is a Senior Technical Fellow at TechInsights with nearly 30 years’ experience in semiconductor process integration for DRAM, (V)NAND, SRAM and logic devices. He regularly provides blog content to TechInsights Memory subscribers. October 15

Ray Fontaine, Product Manager – Image Sensor Ray is one of the preeminent image sensor technology experts in the world, and he regularly publishes Image Sensor analysis content and commentary for TechInsights subscribers. October 11, 2020 Samsung introduced us to the Sony IMX516 i-ToF in Q4 2019

Contributed by: Sinjin Dixon-Warren, PhD The emergence of gallium nitride (GaN) technology in the USB-C chargers is a new trend in the semiconductor market. Over the past year, TechInsights has found GaN technology from Navitas and from Power Integrations in various USB chargers, as published in

Jeongdong Choe, Senior Technical Fellow Dr. Jeongdong Choe is a Senior Technical Fellow at TechInsights with nearly 30 years’ experience in semiconductor process integration for DRAM, (V)NAND, SRAM and logic devices. He regularly provides blog content to TechInsights Memory subscribers. October 8

Sinjin Dixon-Warren, Senior Process Analyst Sinjin Dixon-Warren is a Senior Process Analyst at TechInsights with over 20 years of experience with semiconductor analysis and is a Subject Matter Expert (SME) for Power Electronics Analysis. He holds a PhD in chemical physics from the University of