This report presents a Digital Floorplan Analysis of the VA98B die found inside the Mobileye STME-EyeQ4H system-on-chip (SoC) extracted from the BMW KaFASCamera 66-51-5-A07-E30 automotive camera module. The EyeQ4H SoC, manufactured in STMicro's 28nm FD-SOI process, supports autonomous vehicles with complex and computationally intense vision processing for Automotive applications while maintaining low power consumption at 2.5 Tops. Features include any-angle vehicle detection and lane detection. This report contains the following detailed information:

• Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
• Scanning electron microscopy (SEM) plan-view micrographs showing the layout of the die at the levels including fin/shallow trench isolation (STI), gate, contacts, and minimum pitch metals
• Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
• Plan-view optical micrograph of the die delayered to the metal gate level
• Identification of major functional blocks on a gate level die photograph
• Table of functional block sizes and percentage die utilization
• High-resolution top metal and gate level die photographs delivered in the CircuitVisionsoftware
• Cost of die, based on the manufacturing cost analysis of the observed process