Apple iPhone 17e Teardown

Apple iPhone 17e Teardown: A19 Processor, SK hynix Memory & BOM Analysis

TechInsights' Apple iPhone 17e teardown reveals the A19 processor, 8GB LPDDR5X memory, 256GB SK hynix NAND storage, MagSafe support, and detailed BOM analysis.
Inside Smartwatch Costs: Xiaomi, Samsung, and Huawei Compared

Inside Smartwatch Costs: Xiaomi, Samsung, and Huawei Compared

TechInsights compares the Xiaomi Watch 5, Huawei Watch GT 5 Pro, Samsung Galaxy Watch8 LTE, and Xiaomi Watch S4, revealing how processors, LTE connectivity, displays, and batteries drive smartwatch BOM costs.
Meta Ray-Ban Display Teardown Reveals More Than Meets the Eye

Meta Ray-Ban Display Teardown Reveals More Than Meets the Eye

TechInsights analyzes the Meta Ray-Ban Display and Neural Band, uncovering Qualcomm AR1, display cost drivers, Sony imaging, and key design wins.
SK hynix D1c DRAM Analysis: EUV Drives HBM4E and HBM5

SK hynix D1c DRAM Analysis: EUV Drives HBM4E and HBM5

TechInsights analyzes SK hynix's D1c DRAM node, revealing its mature EUV strategy and implications for HBM4E, HBM5, DDR5, and AI memory.
The Chip Insider®–NVIDIA reinvents itself. Capacity Maxed Out.

The Chip Insider®–NVIDIA reinvents itself. Capacity Maxed Out.

Inside G. Dan Hutcheson’s latest analysis, Nvidia reshapes its strategy with RTX Spark™, driving AI into enterprises while navigating fierce rivals and redefining demand across key computing screens.
Sony LYT-901: Inside Sony's First 200MP LYTIA Image Sensor

Sony LYT-901: Inside Sony's First 200MP LYTIA Image Sensor

Explore TechInsights' analysis of Sony's LYT-901 200MP image sensor, featuring stacked CMOS architecture, QQBC technology, advanced HDR, and hybrid bonding.
The Chip Insider®–Huawei’s Strategic Assault on Moore’s Law

The Chip Insider®–Huawei’s Strategic Assault on Moore’s Law

Discover how Huawei’s LogicFolding push reframes Moore’s Law, spotlighting speed through advanced packaging amid rising cost, thermal, and EDA challenges
The Chip Insider®–Apple, Nvidia, and TSMC: Bifurcation of the Advanced Technology Roadmap for Semiconductors

The Chip Insider®–Apple, Nvidia, and TSMC: Bifurcation of the Advanced Technology Roadmap for Semiconductors

Explore how TSMC’s roadmap split is raising new priorities, yet advancing chips along mobile efficiency and AI-HPC performance paths
Apple Watch Series 11 5G

Apple Watch Series 11 5G

Discover how the Apple Watch Series 11 5G pushes wearable engineering forward with advanced integration, connectivity, sensing, and processing—and what its design reveals about the future of smart devices.
Strait of Hormuz Blog

Why the Strait of Hormuz is a Semiconductor Crisis Waiting to Happen

Strait of Hormuz disruptions threaten semiconductor supply chains and energy stability - learn what role can EcoInsights play to support your team.
Reinventing the IDM

Reinventing the IDM in the AI Era: Why the Old Model No Longer Works

Reinventing the IDM eBook explores how AI is reshaping the semiconductor industry and transforming the IDM model, with strategies to adapt, scale innovation, and stay competitive.
The Chip Insider®–The Iran War’s Helium disconnect update

The Chip Insider®–The Iran War’s Helium disconnect update

Explore how the Iran War’s helium shock raised supply concerns, yet 10 weeks in, resilient supply chains have kept semiconductor sales, production, and costs largely unaffected.
The End of the Carbon Estimate: Why Semiconductor Procurement Now Requires Hard Data

The End of the Carbon Estimate: Why Semiconductor Procurement Now Requires Hard Data

A recent shift in EU sustainability regulations shows carbon reporting is evolving into a supplier deliverable, requiring semiconductor companies to provide precise, product-level emissions data.
2026 Global Semiconductor Supplier Awards

2026 Global Semiconductor Supplier Awards

Since 1988, the Global Semiconductor Supplier Awards have served as the industry’s most trusted independent benchmark for supplier performance, originally established by VLSI Research and now powered by TechInsights.
The Chip Insider®–The New Intel Trinity. Hi-NA too expensive? The TSMC controversy and the inside story.

The Chip Insider®–The New Intel Trinity. Hi-NA too expensive? The TSMC controversy and the inside story.

Discover how Intel’s leadership trio drives strong earnings, better yields, and smarter strategy—raising big questions around Hi‑NA costs and timing.
The Chip Insider

The Chip Insider®– 4 Chips Acts = 2 Successes + 2 Failures with lessons to learn.

G. Dan Hutcheson dives into China, US, EU, and Japan's responses to the global world chip order in the recent The Chip Insider®.