The global cloud market reached $167.7 billion in Q3 2026, growing 55% year over year as AI demand and neocloud providers reshape the market. See this quarter's trends.
Inside G. Dan Hutcheson’s latest analysis: More than 35,000 attendees examined shared industry challenges from geopolitics, power, and water to workforce, while big questions surfaced around CXMT’s DRAM, Terafab’s EUV access, and the next downturn.
AI architectures are diversifying as inference, memory innovation, and new integration approaches change packaging requirements. TechInsights examines what these shifts could mean for advanced packaging suppliers.
Register for three 2027 outlook webinars. Get the free Five Trends report now, plus every 2027 Outlook report as it publishes in the TechInsights Platform.
Inside G. Dan Hutcheson’s latest analysis, the data center water debate takes an unexpected turn as he reveals why traditional cloud data centers and newer AI data centers have vastly different water demands and why AI may not be the water problem many believe it to be.
Explore five trends shaping the 2027 semiconductor market, from memory constraints and AI infrastructure to advanced packaging, emissions and consumer demand.
Semiconductor emissions are forecast to grow faster than silicon shipments through 2031. See how process nodes, electricity, and fab locations shape the outlook.
As DRAM and NAND prices rise, software efficiency is becoming increasingly relevant to hardware decisions. Explore the strategies emerging across major ecosystems.
AI-driven demand is pushing cloud and digital services beyond previous growth expectations. TechInsights forecasts the worldwide market will exceed $5 trillion in annual revenue by 2031, led by continued growth across cloud computing, SaaS, social media, and search.
Inside G. Dan Hutcheson’s latest analysis, the seven layers of the Semiconductor Demand Stack reveal an industry at remarkable highs, as AI demand, semiconductor growth, economic conditions, and geopolitical risks shape the outlook for the cycle ahead.
Whose GaN is it anyway? TechInsights brings together technical analyses to examine the die-supplier relationships behind devices from leading power GaN manufacturers.
Inside G. Dan Hutcheson’s latest analysis: Intel is moving early on High-NA EUV while TSMC holds back, the next technology cycle raises a familiar question: How much could lithography influence the competitive race?
