Latest Blogs and Commentary
Seoul Semiconductor patent auction analysis reveals a mixed bag of assets
Seoul Semiconductor recently dipped its toes into the sales side of the patent market with an announcement that it will be auctioning off two patent packages – one at the end of this month and the other in January.
Power Integrations Scores OEM Design Win with their PowiGaN Technology
Posted: December 12, 2019 Contributing Authors: Sinjin Dixon-Warren, PhD Consumer demand for smaller form factor and higher power, plus government efficiency regulations, are driving innovation in the USB adapter market. The USB-C power delivery
Toshiba-WD Alliance 3D NAND mass production will use Samsung TCAT process
集微网消息（文/Yuna），据Impress Watch网站报道，东芝在12月8日 召开的IEDM会议上声明在3D NAND闪存量产中采用类似于三星TCAT的存储单元结构。
Developing a successful licensing program
As first published in the Patent Lawyer, Martin Bijman, Director of IP Products at TechInsights, explains how formalized assertion programs can benefit rights holders.
DRAM Scaling Challenges Grow
More nodes and alternative memories are in the works, but schedules remain murky.
Comet Lake for desktop will appear around February 2020? Intel CPU roadmap
TechInsights released a digest report titled “Intel Core i7-1065G7“ Ice Lake ”10 nm 2nd Gen Processor Analysis” on October 31st .
Kirin 990 5G core data exposure: 113.31 square millimeters integrated 10.3 billion transistors
Recently, Huawei released its new 5G mobile phone, the Mate 30 5G series. The performance of its Kirin 990 5G SoC is very exciting. Recently, professional chip research institute TechInsights dismantled this commercial 5G integrated SoC chip.
The Apple U1 - Delayering the Chip and Its Possibilities
Posted: November 8, 2019 Contributing Authors: Stacy Wegner Figure 1: the Apple U1 UWB chip One of the most intriguing components included in the iPhone 11 is the mystery chip Apple simply labeled as ‘U1.’ TechInsights has been busily analyzing this
Huawei Mate 30 Pro 5G Teardown
Introducing the Kirin 990 5G Posted: November 7, 2019 Contributing Authors: Daniel Yang, Stacy Wegner The Huawei Mate 30 Series is the latest installment of the company’s annual flagship smartphones, released on September 19, 2019 in Munich
TIPS Webinar: Techniques to Analyze NAND Flash and SSD Devices
In this presentation, we will examine some of the areas of innovation in NAND Flash and SSD devices and provide an overview of the various testing methods we apply to analyze these innovations. This information is useful in supporting patents and finding evidence of use.
Intel Core i7-1065G7 “Ice Lake” 10 nm 2nd Gen Processor Analysis
Intel has released their first 10 nm 2 nd Gen processor into consumer products – the Intel Core i7-1065G7 processor, better known as Ice Lake. Dell and Microsoft have already announced the inclusion of Ice Lake in some of their latest offerings. This
The Evolution of SiC MOSFET Technology: A Retrospective
Posted: October 31, 2019 Contributing Author: Sinjin Dixon-Warren Silicon carbide (SiC) is a widely used industrial material. Widescale production by the Carborundum Company started in 1893 following the discovery of the Acheson process, which is
The Apple iPhone 11, 11 Pro & 11 Pro Max Review: Performance, Battery, & Camera Elevated
TechInsights has now officially released a die shot of the new Apple A13, and we can confirm a few assumptions on our side.
Apple U1 TMKA75 Ultra Wideband (UWB) Chip Analysis
One of the most interesting components from the recently released Apple iPhone 11 line of phones is one that Apple has said very little about; the Apple U1 Ultra Wideband (UWB) chip. So far, Apple has said only that the chip enables directional
TechInsights: iPhone 11 Pro Max Cameras Cost $73.5
TechInsights publishes its estimation of Apple iPhone 11 Pro Max components. The cameras appear to be the post expensive part at $73.50.
How e-mobility is changing the Automotive
With some TechInsights industry experts, Morahari Reddy and Jianchun Xu, we will analyze the market and focus on different aspects.
E-Government - Deep Analysis of Intel Ice Lake: Innovation across Six Pillars
At this year's Taipei Computer Show, Intel introduced the 10th generation Core processor, which is the 10nm process Ice Lake processor.
SK hynix 96L 3D PUC NAND Analysis
Among memory manufacturers worldwide SK hynix currently holds the 5th position in NAND Flash market share, with 10.3%. They are the latest to release a 9X-layer NAND solution, with the SK hynix 96L 3D PUC NAND. Development of SK hynix’ 96L 3D PUC