Featured Report Analysis
Summary - Hik Vision DS-2CD2087G3-LI2UY/SL Deep Dive Teardown
Hikvision’s DS‑2CD2087G3‑LI2UY/SL is an EU‑market security camera, with Deep Dive revealing its design, build, and cost through full teardown analysis.
GalaxyCore GC50F6 Standard Floorplan Analysis
A Standard Floorplan Analysis of the GalaxyCore GC50F6, with analysis on foundry identification and a summary of the salient features observed.
Mediatek Dimensity 9500 Advanced Packaging Quick Look
This advanced packaging quick look of MediaTek Dimensity 9500 demonstrates advanced packaging techniques and features cutting edge MT6993Z processor.
STMicroelectronics FX62A 28 nm FD-SOI ePCRAM Memory Floorplan Report
MFR delivers in-depth insight into memory design, device floorplan, block structures, and full die and package cost analysis.
Insight: Ferrari Breaks Flat Screen Hegemony with Samsung, Corning
Ferrari previews Luce EV with tactile switches, aluminum‑glass design, and new displays co‑developed with Corning and Samsung.
India’s C2S Programme Signals a Structural Push in Semiconductor Design Talent
India’s C2S program trains thousands on chip design, aiming to build industry‑ready talent and grow India’s semiconductor design capabilities.
Insight: STMicroelectronics’s Stellar P3E adds Edge Intelligence for X-in-1 Powertrain Systems
Stellar P3E adds an NPU and PCM‑based memory to boost electrification controllers, aiming for smarter control while keeping ASIL‑D features.
Semiconductor Analytics – February 11, 2026
Analysis of semiconductor analytics for the week of February 6, 2026 showed an increase in sales on weekly and YoY basis.
Insight: Automotive Semiconductor Lead Times Rose by Almost Two Weeks in Q4 2025
Automotive semiconductor lead times rose by nearly two weeks in Q4 2025.
Narrative: Global Smartphone Vendor and OS Market Share by Region: Q4 2025
YoY global smartphone shipments increased 3.3% in Q4 2025, as the Middle East and Africa generated double-digit growth rates. Apple remained leader in Q4 2025.
Analysis: Power semiconductor for datacenter power distribution
AIs shift to accelerator-centric computing drives datacenter power semiconductor revenue forecasts to $5B in 2026.
Qualcomm’s 2nm Tape-Out and India’s Evolving Role in Advanced Semiconductor Design
Qualcomm’s 2nm tape‑out with India teams shows India taking shared system‑level design roles in advanced semiconductor work.
Infineon IGLT65R055B2 CoolGaN G5 650 V Bi-Directional Switch Power Essentials
Infineon IGLT65R055B2: 650V BDS GaN with 55 mΩ design, enabling bidirectional to replace back‑to‑back GaN HEMTs.
Summary - Samsung Galaxy Tab S11 Ultra (SM-X936B) Deep Dive Teardown
Galaxy Tab S11 Ultra pairs Dimensity 9400+ power with pro design, backed by deep‑dive teardown insights for tech and cost clarity.
Silicon Labs SiMG301 Series 3 Multiprotocol Wireless SoC Floorplan Analysis
SiMG301 boosts ultra‑low‑power IoT with multi‑core security, strong RF, and seamless Zigbee‑Matter support in a compact Series 3 SoC.
Assembly and Test Cost and Price Model - revision 20260206.
Recently redesigned model covers all the latest 2.5D and 3D packaging technologies.
Narrative: Apple Watch by Model Q4 2025
Q4 2025 Apple Watch shipments dropped by 1% YoY, with the SE (gen 3) leading as the top model.
Advanced Packaging – Automotive Processors
Automotive industry is evolving toward centralized, software‑defined systems - but changes to advanced packaging, ecosystem collaboration, and material strategies will be critical to meet performance requirements.