Latest Blogs and Commentary
Memory Executive Fireside Chat | Technology Roadmaps, Markets & Materials Come Together
Join Dr. Jeongdong Choe, Mike Howard, Walt Coon, and Mike Walden for a live discussion exploring how the latest memory technology roadmaps, market dynamics, and semiconductor materials innovation are shaping the future of the memory industry.
Apple iPhone 18 Memory Costs: DRAM & NAND Price Pressure
DRAM and NAND prices are rising through the iPhone 18 launch. See what higher memory costs could mean for Apple, AI, BOM costs, and smartphone strategy.
Apple iPhone 18 Pro: A20 Pro, Camera, C2 Modem & Key Changes
Explore what is new in the Apple iPhone 18 Pro and Pro Max, including the 2 nm A20 Pro, variable-aperture camera, C2 modem, cooling, and battery.
Can 2200 V PowiGaN Challenge Silicon Carbide?
Access TechInsights’ special report on Power Integrations’ 2200 V PowiGaN demonstration and its potential impact on high-voltage power semiconductor markets.
iPhone 18 Storage Pricing: Apple's New $1,200 Upgrade
Apple changed iPhone 18 storage pricing with escalating $200, $400 and $600 upgrades. TechInsights examines what it could mean for margins and buyers.
Global Memory Market Update | Supply and Demand, Pricing & AI-driven growth
Join Mike Howard and Walt Coon for a data-driven analysis of the global memory market, including supply and demand trends, pricing, AI-driven growth, competitive positioning, and what to expect over the next several years.
The AI Boom Is Rewriting Capital Equipment Demand
Get the latest 2026 WFE Forecast: five-year projections for lithography, etch, deposition, and eleven other equipment segments, free for two weeks.
Apple iPhone 18 Rumors: Pro, A20 and Foldable Preview
Explore Apple iPhone 18 Pro and foldable iPhone rumors, including the A20 Pro, 2 nm silicon, C2 modem, cameras, memory, suppliers, and release strategy.
OpenAI Jalapeño: The Architectural Decisions Behind Its Inference Efficiency
OpenAI Jalapeño's benchmark results have attracted attention, and a closer look at the design choices provides important context for understanding the performance. This article presents TechInsights’ commentary on the decisions disclosed at Hot Chips.
What a Die-level Analysis Reveals About Apple's M5 Pro GPU Design
When Apple announced the processor, much of the discussion focused on how the two dies were connected and the role of TSMC's SoIC-X face-to-face (F2F) hybrid bonding technology. The next question is how Apple laid out the GPU die, which we examined in our latest Digital Floorplan Quick Look (DFQ).
The Chip Insider®– Risk of an AI Bubble
Inside G. Dan Hutcheson’s latest analysis, he explains why the AI boom bears all the hallmarks of a bubble, tracing its unprecedented rise from millions to over $100 billion and exploring how lasting value is created long after market speculation fades.
2027 CMC Conference Arizona | Semiconductor Materials Conference
Join the 2027 CMC Conference in Chandler, Arizona, April 20–22, for semiconductor materials insights on manufacturing, supply chains, advanced packaging, sustainability, and emerging technologies.
Don’t Let Carbon Compliance Cost You Customers: The New Rules for Semiconductor Supply Chains
Accurate carbon reporting is now required across the semiconductor supply chain. Learn how to build an auditable data strategy to maintain your market position.
HiSilicon Kirin 9030 Pro Process Flow Analysis: How Does SMIC’s N+3 Process Compare to Leading-Edge Nodes?
How does SMIC N+3 compare with other leading-edge nodes? A process flow analysis of the Kirin 9030 Pro provides the measured layer-by-layer evidence.
Memory Technology Roadmap Webinar | DRAM, NAND, HBM & Emerging Memory
Join TechInsights for an in-depth webinar on DRAM, NAND, HBM, and emerging memory technologies. Explore AI-driven innovation, scaling challenges, and the future of semiconductor memory with Dr. Jeongdong Choe.
Intel Core Ultra X7 358H Microprocessor: Evaluating the Foveros-S 2.5D packaging technology
The Intel Core Ultra X7 358H combines three active tiles in a single Foveros-S 2.5D package. TechInsights’ Advanced Packaging Quick Look documents how Intel implemented the package, including its materials, interconnects, and structural design.
Co-Packaged Optics (CPO): Mapping the Market and Supply Chain Ecosystem Behind AI Datacenters
Who is positioned to compete as co-packaged optics (CPO) scale? TechInsights maps the market, supply chain, critical bottlenecks, and vendor landscape.
US Hyperscalers Now Drive 15 of the World’s Top 20 Datacenter Markets
Where are hyperscalers concentrating datacenter capacity? Q1 2026 data shows why 15 of the top 20 markets are in the US and which cloud providers lead.