2025 Advanced Packaging Outlook Report

Unlocking the Future of Semiconductor Packaging

As we look ahead to 2025, the semiconductor packaging landscape is on the verge of transformation, driven by innovations in AI, automotive technology, and data center expansion. TechInsights' Advanced Packaging Outlook Report provides an in-depth analysis of the upcoming trends and market dynamics set to shape the future of advanced packaging.

Advanced packaging plays a critical role in the performance, efficiency, and integration of semiconductors. With the rapid growth of AI-powered applications, high-performance computing, and automotive systems, advanced packaging solutions such as interposers, chiplets, and fan-out panel-level packaging (FO-PLP) are becoming essential for scaling performance while managing costs and power consumption.

Key Highlights of the Report

Interposers for AI and Data Centers

The demand for processors paired with high-bandwidth memory (HBM) in AI-driven data centers continues to rise. Companies like SK hynix are reducing costs through innovations like direct stacking and advanced substrates.

Panel-Level Packaging (PLP)

FO-PLP (Fan-Out Panel-Level Packaging) is gaining momentum, offering cost-effective and higher performance solutions for AI chips and consumer electronics. Leaders like Samsung and NVIDIA are driving adoption, enhancing thermal management and efficiency.

Automotive Chiplets

Chiplet technology is becoming pivotal in automotive applications, including advanced driver-assistance systems (ADAS) and autonomous driving. This shift allows faster development and improves safety and reliability.

Silicon Photonics

As AI applications demand more bandwidth, silicon photonics is enabling faster, more efficient optical communication. Companies like TSMC are integrating this technology into 3D packaging for lower power consumption and enhanced performance.

Glass Substrates

Glass substrates are emerging as a promising, cost-effective option for advanced packaging, providing better thermal stability and reliability, especially for automotive and AI chip applications.