Discrete Semiconductors and Passives categories price decrease trend continued in Q1 2024 and is expected come to an end is Q2. We anticipate prices to increase in 2H 2024 for both segments. Lead times are expected to be relatively flat in most categories throughout 2024 except for discrete and passives components.
Advanced Packaging Outlook 2027: Five Trends Reshaping CoWoS, HBM and Chiplets
Advanced packaging will cap semiconductor growth in 2027. Explore how CoWoS, HBM4 and chiplets are reshaping capacity, yields and supply-chain strategy for AI accelerators.
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Chip Observer | Semiconductor Industry Briefing — October 2026
October’s semiconductor briefing: Apple’s first 2 nm iPhone chip, AI infrastructure and memory demand, foundry expansion, and major industry deals.
