Analysis of the floorplan design used in the Zentel A3F4GH40ABF 25 nm 4 Gb DDR4 DRAM and includes an executive summary and supporting image sets optical, X-ray, SEM cross sectional, and SEM bevel imaging sets. Process node and foundry identification, critical dimensions, memory and periphery functional block summaries and die/package cost analysis are provided.
Apple iPhone 18 Memory Costs: DRAM & NAND Price Pressure
DRAM and NAND prices are rising through the iPhone 18 launch. See what higher memory costs could mean for Apple, AI, BOM costs, and smartphone strategy.
Apple iPhone 18 Pro: A20 Pro, Camera, C2 Modem & Key Changes
Explore what is new in the Apple iPhone 18 Pro and Pro Max, including the 2 nm A20 Pro, variable-aperture camera, C2 modem, cooling, and battery.
Can 2200 V PowiGaN Challenge Silicon Carbide?
Access TechInsights’ special report on Power Integrations’ 2200 V PowiGaN demonstration and its potential impact on high-voltage power semiconductor markets.
