Case Study

Using TechInsights’ Advanced Packaging to Effectively Position and Communicate a Product’s Value to a Target Audience

Using TechInsights’ Advanced Packaging to Effectively Position and Communicate a Product’s Value to a Target Audience

The Challenge

The marketing team at a fabless semiconductor company faced pressure to respond to a competitor's campaign that was touting enhancements to its product roadmap, driven by advanced packaging. Specifically, the competitor's messaging emphasized the integration of chiplet designs, improved thermal management, and power efficiency as unique selling points. Due to this, the customer’s marketing team needed to quickly develop a campaign demonstrating their own packaging technology as a leading-edge solution.

However, the team lacked the granular insights they needed to evaluate their competitor’s packaging strategies, understand the specific advantages of their own solutions, and gather the data required to back up their claims. Without these critical insights, they struggled to position their technology effectively in the market and communicate a compelling value proposition to original equipment manufacturers (OEMs). Additionally, the marketing team needed to refine its customer segmentation to ensure that marketing resources were focused on the right customer profiles, maximizing return on investment (ROI).

The Solution

TechInsights’ Advanced Packaging Product provided the customer with the data-driven insights they needed to craft a strategic response to their competitor’s campaign. By leveraging SoC market coverage, the team gained visibility into design start trends, which helped them validate the relevance of their own product roadmap in the context of evolving market demands. This allowed them to collaborate more effectively with their strategy team to highlight design cost advantages as a key differentiator in their messaging.

Furthermore, TechInsights’ reverse engineering analysis coverage enabled the company to directly compare their advanced packaging solutions against those of their competitors. Regular updates on materials and emerging chiplet design strategies helped the marketing team continuously refine their messaging, ensuring it stayed competitive and accurate. With this knowledge, the team could effectively showcase their advanced packaging strategy’s unique benefits, especially in areas like thermal management and power efficiency.

The Results

By leveraging actionable insights from TechInsights, the customer’s marketing team was able to craft clear, data-backed messaging around their existing solutions and differentiate themselves from the competition. A deeper understanding of competitors’ design choices and trade-offs empowered the team to respond confidently to the competitor’s campaign, emphasizing their own packaging technology’s unique strengths.

This strategic response helped mitigate the risk of being perceived as a follower in adopting advanced packaging and chiplet designs. Instead, the company was able to position itself as a leader in these areas, addressing OEM concerns and solidifying its reputation in the market. Ultimately, the marketing team refined its customer segmentation approach, leading to better-targeted marketing campaigns and improved ROI.

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2025 Advanced Packaging Outlook Report

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