How TechInsights’ Memory Offering Helped a Fabless Company Conquer the Embedded NVM Market

The Challenge

The organization needs to develop and deliver high-performance, low-power robust NVM solutions at a competitive price to its foundry customers. As the NVM embedded memory market expands, the company aims to design devices that are not only smaller and easier to integrate into applications, but that are also more reliable than those of its competitors to establish a strong presence in this emerging market. To achieve this, the organization requires up-to-date and accurate data to monitor the market trends and competitors' technologies, allowing it to gain a competitive edge. Additionally, a thorough understanding of various packaging technologies is essential to ensure their memory core designs perform reliably across diverse thermal environments, making their product robust across a variety of end use applications.

The Solution

TechInsights’ Memory provided the business with detailed embedded NVM process and process flow analyses on leading market devices. This enabled the company to conduct competitive benchmarking of their memory technology.

TechInsights’ Advanced Packaging product further supported the organization by providing comprehensive stack-up and materials information, along with parameter inputs for their thermal models. This allowed them to simulate the effects of different packaging technologies on design performance, ensuring their memory modules would maintain optimal functionality across a variety of thermal environments and applications. By selecting the best packaging technology for optimal performance across as many applications as possible, the business also simplified manufacturing processes for customers purchasing their IP blocks.

The Results

Using TechInsights’ Memory analysis, the business was able to successfully benchmark competitive products and identify key areas where their own designs are differentiated. This insight was imperative for gaining market share and establishing a foothold in the embedded non-volatile memory market.

With TechInsights’ Advanced Packaging they could also perform thermal modeling on their memory core designs to simulate performance with various packaging technologies. This ensured optimal thermal performance across different end use applications including both terrestrial and aerospace environments and established them as a key player in the NVM space.