Latest Blogs and Commentary
IDM and Foundry Sales, Capacity, Capex
A sampling of Integrated Device Manufacturers (IDMs) and Foundries important to the automotive industry shows wafer capacity expanded by 9% on average in 2023 after large capital expenditures for fabs since 2020. Several IDMs increased fab capacities in 2023 well above 9% include Samsung, Texas Instruments, Rohm, Infineon, and Microchip.
SK hynix Hi-5021Q Process Flow Analysis
Process flow analysis of the SK hynix Hi-5021Q, a 50 MP 0.70 µm pixel pitch CMOS image sensor. This is the first 0.70 µm pixel from SK hynix analyzed by TechInsights, and it uses the first high-volume production, commercially available image sensor with innovating air gap grid.
Research Bulletin – Top-50 Semiconductor Supplier Marketshare Climbs to 90% in 2023
The top‑50 semiconductor suppliers accounted for 90% of the $559.1 billion global semiconductor market last year, an increase of four points from 86% in 2022.
Qualcomm QTM565 FR2 Antenna in Package (AiP) Packaging Analysis
The Qualcomm QTM565 antenna in package (AiP) is a 5th generation 5G mmWave antenna solution for mobile handsets. It features simultaneous transmit/receive front-end die and power management functions. The physical packaging of the QTM565 is similar to its predecessor the QTM545, with a central printed wiring board (PWB) hosting the dies and the antenna elements comprising separate laminate blocks.
Recovering Tablet Market Holds Breath for iPad Launch
Led by strong results from Android vendors and resurgent Chinese brands in their domestic market, the global tablet market shipments contracted only 3% in Q1 2024 compared to the year-ago quarter.
Electronics Forecast 2024
Explore the 2024 electronics sales forecast, highlighting surges in IT infrastructure, server sales, and storage solutions. Gain insights into projected sectoral growth and market dynamics shaping the industry landscape for the year ahead.
Q1 2024: Apple: Underperformed With Sluggish Demand In Developed Markets
Apple iPhone shipments declined 11% YoY to reach 49.2 million units and 17% market share slipping to second spot in global smartphone market in Q1 2024. One key reason for decline is slowdown in China given Huawei’s growth in the country as well as the restriction from Chinese government limiting use of iPhones by government officials. Moreover, not just China, iPhone shipments declined in most of the regions amid lengthening replacement cycle.
India Smartphone Vendor and OS Market Share: Q1 2024
India smartphone market grew by 10% annually but declined by -11% sequentially in Q1 2024. A double-digit annual growth in the first quarter of 2024 itself augurs well for the whole year. Xiaomi, Vivo and Samsung were the top three smartphone vendors in the quarter.
Qualcomm SDR875-004 Converged RF Transceiver LNA Block RFIC Process Analysis
The HG11-13972-2 RF transceiver die from the Qualcomm SDR875-004 RF transceiver was removed from the Samsung S24 Ultra 5G smartphone (SM-S928W).
North America Smartphone Vendor & OS Market Share by Country: Q1 2024
Growth in the North American smartphone market declined in Q1 2024, the seventh quarter in a row of negative annualized growth for the region. Six of the Top-10 brands recorded negative annual shipment growth. Apple was the Number 1 smartphone vendor in the quarter by units shipped and Samsung led in Android.
Broadcom BCM88920 StrataDNX™ Ramon3 51.2Tb/s Fabric Element BGA Exploratory Packaging Report
The Broadcom BCM88920 StrataDNX™ Ramon3 is telecommunications industry switch gear packaged in a flip-chip ball grid array (FC-BGA) style package. It has a large footprint with over 9,000 package connections and a very low die-to-package ratio. This report presents detailed delayering of the organic substrate supporting the chip, as well as die photographs and analysis.
New Versal AI Edge Adaptive SoCs Will Boost Scalar Compute
AMD plans a second generation of Versal AI Edge devices that integrate more CPUs with a more efficient hardware accelerator to bring more AI inference capability to edge applications.
Blackwell Pod Brings Exascale to a Rack
NVIDIA’s Blackwell pods bring exascale compute to a rack while pushing the power envelope to 120 kW. The DGX GB200 NVL72 pod offers up to 1.44 ExaFLOPS of FP4 performance.
Vision 4DR Takes On 4D Imaging Radar
Cadence has updated its Vision DSP line to handle radar data types and instructions. It’s also offering an accelerator for high-FFT workloads such as 4D imaging radar.
Deep Dive Teardown of the Huawei Freeclip T0017C Wireless Earbuds
Several manufacturers share the design wins for the Huawei FreeClip wireless earbuds. The Bluetooth 5.3 SoC is supplied by WuQi. Maxscend provided BLE Voice Remote Control. ConvinientPower supplied the High Efficiency Wireless Power Receiver. SOUTHCHIP provided charging chips.
Sony 1.8MP 1.5μm Pixel Eye Tracking Camera from Apple Vision Pro Device Essentials
The Sony IR Eye Tracking Camera CMOS image sensor (CIS) was extracted from the Apple Vision Pro Headset (A2117). The Sony CIS is a 1.8 MP, monochrome, 1.5 μm, stacked back-illuminated (BI) electronic rolling shutter utilizing Exmor RS technology.
Samsung GM5 ISOCELL 2.0 Standard Floorplan Analysis
The ISP die from the Samsung S5KGM5SX, a rear periscope-telephoto camera module that was extracted from the Google Pixel 7 Pro smartphone. The camera module measures 29.6 mm × 14.4 mm × 6.8 mm thick. It contains a stacked imager comprising a CIS die and an ISP die.
Survey Plus Teardown of the Xiaomi Redmi A3 23129RN51H Smartphone
The Xiaomi Redmi A3 has a 90Hz, 6.71-inch IPS LCD display with a resolution of 720 x 1650. The Redmi A3 has three cameras. The main one is an 8 MP Wide-Angle Rear Camera with an image sensor made by SmartSens, the second one is 0.08 MP QVGA Rear Camera with an image sensor made by SmartSens, and the last one is a 5 MP Wide-Angle Front Camera with an image sensor made by SmartSens. The device supports 10 W wired charging.