Integrated Device Manufacturer
TechInsights empowers Integrated Device Manufacturers with leading semiconductor insights and industry analysis for building winning products.
Our comprehensive analysis enables IDMs to stay ahead of the curve by benchmarking their chip designs against competitors, making well-informed decisions backed by valuable data, and strategically planning for future developments in the semiconductor market.
Your IDM Solutions
Through TechInsights, Platform members have the opportunity to subscribe to IDM solutions and multiple add-ons all in one place.
Advanced Packaging
Advanced packaging provides deep technical analysis for Logic, Power, and Image Sensors combined with market outlooks, forecasts, and structure of advanced packaging techniques including Chiplets.
Automotive
Understand the automotive landscape to design processors that meet the demand and increase your business during a time of explosive growth. With forward-looking forecasts, research, and teardown analysis to validate the growing adoption of UX features and usage, you can design and plan to compete and win.
Consumer Electronics
Understand the consumer electronics landscape to improve design and production planning. With validated demand data, cost analysis forecasts, teardown analysis, and industry insights, you can align your designs and plans to better compete in the market.
Image Sensor
Identify opportunities for process and cost optimizations with detailed analyses on state-of-the-art image sensors.
IoT Connectivity SoC
Optimize signal integrity for in-vehicle device connectivity with visibility into how competitive wireless transceivers support the latest protocol versions with their technology and design choices.
Logic
Evaluate competitiveness against fabless and foundry partnerships with in-depth market, process technology and product design analysis on market-leading SoCs.
Manufacturing Equipment
Get visibility into the semiconductor supply chain so you can optimize production planning and increase quality assurance. Gain a competitive advantage by making data-driven decisions, accelerating time to market and fostering innovation when it comes to product development.
Memory
Support new design and process requirements with an end-to-end view of NAND, DRAM, and embedded and emerging memory technologies.
Mobile RF
Accelerate RFIC development and increase product differentiation by comparing design approaches from other IDMs and understanding process parameters of the competition.
Power
Maintain competitiveness from both a design and manufacturing perspective with visibility into the latest innovations, process advancements, and material changes in the power semiconductor landscape.
Semiconductor Executive Insights
Use our candid insights on global economic and business conditions, trends and outlooks impacting the semiconductor industry to help you make appropriate business decisions quickly and with confidence.
Smartphone and Tablet
Learn what innovations are in demand and will soon be within the smartphones, tablets, and wearables landscape. Using our reports and analysis, design semiconductors with advanced process technologies, power efficiency, security enhancements, the integration of AI, and more to meet the needs of your end customers.
Add-on Solutions
Add-on solutions provide supplementary features and functionalities, enhancing the capabilities of the core TechInsights product or service.
Semiconductor Manufacturing Economics
Supply relationship and activity databases for semiconductor growth areas and detailed volume forecasts for chips in automotive and consumer electronics markets.
BOM Database and BOM Database with Subsystems
TechInsights' BOM costing and design wins database contains three decades of accumulated semiconductor data from our Teardown analysis of consumer electronics products.
Component Price Landscape
(CPL)
Leading index for tracking 140+ commodity EE component categories and 50,000+ MPNs, aiding purchasing decisions.
Semiconductor Market Analysis by Technology
Market forecasts, market share, technology roadmaps, and supply chain signaling for all major technologies including compute, sensors/image, analog/RF, power, memory and SoC.
Semiconductor Manufacturing Carbon Model
Detailed, bottom-up analytics around carbon emissions including company and fabrication specific process and facility calculations, models training edge, current and projected 300mm processes, and more.
Component Price Analyzer (CPA)
The CPA tool examines the Bill of Materials (BOMs) for individual customers in the field of electrical engineering. CPA compares the prices of components provided by the customers with the average market prices based on their purchase volume.
Semiconductor Market Analysis by End Market
Market forecasts, market share, technology roadmaps, and supply chain signaling for all major companies and end markets across mobile, cloud/datacenter, AI, automotive, and more.
Manufacturing Insights
Get visibility into the semiconductor supply chain so you can optimize production planning and increase quality assurance. Gain a competitive advantage by making data-driven decisions, accelerating time to market, and fostering innovation when it comes to product development.
Expand Your IDM Solutions
Advanced packaging provides deep technical analysis for Logic, Power, and Image Sensors combined with market outlooks, forecasts, and structure of advanced packaging techniques including Chiplets.
Offering
What's included
TechInsights' Packaging coverage helps you understand all aspects of advanced logic technologies, gain visibility into the competition’s historical – and anticipated – approach, and make better next-node technology choices.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Dashboard Access
- Packaging
TechInsights' CMRS Forecast Pro provides critical datasets for semiconductors, silicon, packaging, designs and reticles along with semiconductor inventories, capacity and supply-demand analysis.
- Market Data
- Demand Forecasts
- Inquiry Privileges
- Dashboard Access
Enables the comparison of various RFIC advanced packaging implementations to gain a better understanding of how they impact RF system design. This includes aspects such as DC and RF performance pertaining to module packaging, size and thermals, and heterogeneous integration. Analysis includes SEM cross-sectional and EDS materials analyses.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Packaging
Our Chiplets coverage tracks usage across 33 end markets and provides a breakdown of chip market research total addressable market (TAM) split between monolithic and chiplet, enabling customers to better understand the market opportunity for advanced packaging alternatives such as chiplets and to better target the highest potential TAM opportunities.
- Competitor Analysis
- Market Data
- Demand Forecasts
- Supply Analysis
- Inquiry Privileges
- Cost Analysis
- Block Diagram
- Product Features
- EE Component Usage Across Products
- Component Prices
For Fabless, IDM Semiconductor, IP vendors, and Foundries, SoC Markets explains how to optimize design costs for intricate SoCs. Understanding which chip designs and applications are driving market growth allow these companies to validate licensing and royalty revenues. With Reverse Engineering, market presence and technical performance are verified with continuous finetuning of existing models.
- Competitor Analysis
- Market Data
- Insight Reports
- Demand Forecasts
- Supply Analysis
- Inquiry Privileges
- Dashboard Access
- Cost Analysis
- Block Diagram
- Product Features
TechInsights' Device Essentials provides broad coverage of the enabling technologies and pixel architectures in use in array imagers, time-of-flight (ToF), event-driven, biometric, and other optical sensors. Tactical reporting on new solutions as they come to market is augmented by curated analyst content.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Packaging
- Process
Power Essentials (GaN, SiC, Si)
TechInsights' Power Essentials provides in-depth process analysis for GaN, SiC, and Si power devices, and comprehensive coverage of device metrics and salient features. Analysis includes detailed structural and material analysis using techniques such as SEM, TEM, and SCM/sMIM, covering package and die images/X-rays, SEM planview and cross-sectional images with annotated SEM-EDS material analysis conclusions, and cross-sectional TEM images with annotated TEM-EDS/EELS analysis conclusions for GaN devices, cross-sectional and planar SCM (sMIM) analysis for Si and SiC.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Process
Understand the automotive landscape to design processors that meet the demand and increase your business during a time of explosive growth. With forward-looking forecasts, research, and teardown analysis to validate the growing adoption of UX features and usage, you can design and plan to compete and win.
Offering
What's included
TechInsights’ Automotive Connected Mobility covers all key aspects of car subscriptions, Mobility as a Service, car sharing, and ride hailing. It includes analysis of the regulatory environment, OEM strategies, business models, user experiences, and financial performance of public and private entities in these markets. Our analysis helps you understand current market trends and what the implications of them are for your company. Our analysts help you unpack the numbers to give you a competitive advantage.
- Competitor Analysis
- Market Data
- Insight Reports
- Demand Forecasts
- Inquiry Privileges
- Dashboard Access
TechInsights’ Autonomous Vehicles coverage offers forecasts and analysis both of today’s ADAS technologies as well as an expert, independent view on what the future of automated driving will bring, and where the resulting opportunities will lie. It includes deep coverage at the system, semiconductor and sensor levels, as well as a broad view of whole value chain.
- Competitor Analysis
- Market Data
- Insight Reports
- Demand Forecasts
- Supply Analysis
- Inquiry Privileges
- Dashboard Access
TechInsights’ Electric Vehicles coverage offers forecasts and analysis of the rapidly-growing and strategically vital electric vehicle market. It offers deep analysis at the system, semiconductor, and sensor levels, as well as a broad view of the whole value chain, along with valuable insights covering global and regional regulatory and policy dynamics, OEM strategies, emerging technologies, and economies.
- Competitor Analysis
- Market Data
- Insight Reports
- Demand Forecasts
- Supply Analysis
- Inquiry Privileges
- Dashboard Access
TechInsights’ Automotive Infotainment & Telematics covers all key aspects of in-vehicle infotainment, wireless communication and connectivity adoption in the connected car. It includes detailed semiconductor and system market sizing, including unit, revenues and ASPs, along with granular Tier 1 and semiconductor supplier market shares. It also looks at software trends, including OS usage, and OTA implementations.
- Competitor Analysis
- Market Data
- Insight Reports
- Demand Forecasts
- Supply Analysis
- Inquiry Privileges
- Dashboard Access
In-Vehicle UX gives you instant access to our extensive consumer research and analysis of the latest trends impacting the automotive user experience.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Dashboard Access
Powertrain Body Chassis Safety
TechInsights’ Powertrain, Body, Chassis and Safety is the industry’s premier source of market information on the complex global automotive electronics market. It covers over 100 different automotive electronics systems, including the resulting semiconductor and sensor demand. It also assesses the impact of vehicle architecture change on the automotive ecosystem.
- Competitor Analysis
- Market Data
- Insight Reports
- Demand Forecasts
- Supply Analysis
- Inquiry Privileges
- Dashboard Access
ADAS Controller Teardown provides curated data with technical insight on ADAS to reveal design wins and provide valuable context on how individual components contribute to the larger picture. They include ICs identification and costing, Reports containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas, Die photos for major ICs and tables for features descriptions and dimensional data, Costed bill of materials (BOM) spreadsheets, RF block diagrams, System block diagrams.
- Competitor Analysis
- Market Data
- Insight Reports
- Supply Analysis
- Cost Analysis
- Block Diagram
- Product Features
- High Resolution Images
ADAS Design Material & Assembly
ADAS Design Material and Assembly provides detailed teardown photos and annotations describing assembly techniques, material function, material composition, IC selection and mechanical features of modules to help OEMs reach mass market deployments quickly and cost-effectively. It also includes: Isometric views of the products with dimensions and callouts of major mechanical or other visible features contributing to specific functions, Images of subassemblies and their major components, Weights and dimensional attributes of key components, Materials, fabrication processes, assembly processes and features, PCB dimensions and fabrication details*, Surface treatments*, Thermal solutions, Environmental/EMI (electromagnetic interference) and EMC (electromagnetic compatibility) seals IC selection* = Where identifiable.
- Competitor Analysis
- Market Data
- Insight Reports
- Supply Analysis
- Cost Analysis
- Block Diagram
- Product Features
- High Resolution Images
Camera Teardown provides curated data with technical insight on cameras to reveal design wins and provide valuable context on how individual components contribute to the larger picture. They include ICs identification and costing, Reports containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas, Die photos for major ICs and tables for feature descriptions and dimensional data, Costed bill of materials (BOM) spreadsheets, RF block diagrams, System block diagrams.
- Competitor Analysis
- Market Data
- Insight Reports
- Supply Analysis
- Cost Analysis
- Block Diagram
- Product Features
- High Resolution Images
LiDAR Design Material & Assembly
LiDAR Design Material and Assembly provides detailed teardown photos and annotations describing assembly techniques, material function, material composition, IC selection and mechanical features of modules to help OEMs reach mass market deployments quickly and cost-effectively.
- Competitor Analysis
- Market Data
- Insight Reports
- Supply Analysis
- Cost Analysis
- Block Diagram
- Product Features
- High Resolution Images
LiDAR Teardown provides curated data with technical insight on LiDAR to reveal design wins and provides valuable context how individual components contribute to the larger picture. They include ICs identification and costing, Report containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas, Die photos for major ICs and tables for features description and dimensional data, Costed bill of materials (BOM) spreadsheet, RF block diagram, System block diagrams.
- Competitor Analysis
- Market Data
- Insight Reports
- Supply Analysis
- Cost Analysis
- Block Diagram
- Product Features
- High Resolution Images
Audio Amplifier Teardown provides curated data with technical insight on audio amplifiers to reveal design wins and provides valuable context on how individual components contribute to the larger picture. They include: ICs identification and costing, Report containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas, Die photos for major ICs and tables for features description and dimensional data, Costed bill of materials (BOM) spreadsheet, RF block diagram, System block diagrams.
- Competitor Analysis
- Market Data
- Insight Reports
- Supply Analysis
- Cost Analysis
- Block Diagram
- Product Features
- High Resolution Images
Infotainment Teardown provides curated data with technical insight on infotainment to reveal design wins and provides valuable context how individual components contribute to the larger picture. They include: ICs identification and costing, Report containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas, Die photos for major ICs and tables for features description and dimensional data, Costed bill of materials (BOM) spreadsheet, RF block diagram, System block diagrams.
- Competitor Analysis
- Market Data
- Insight Reports
- Supply Analysis
- Cost Analysis
- Block Diagram
- Product Features
- High Resolution Images
The Automotive IC Design Win Database provides access to design wins from 500+ automotive products from 25+ tier 1 suppliers and 10 OEMs.
- Competitor Analysis
- Market Data
- Insight Reports
- Supply Analysis
- Cost Analysis
- Block Diagram
- Product Features
- High Resolution Images
Understand the consumer electronics landscape to improve design and production planning. With validated demand data, cost analysis forecasts, teardown analysis, and industry insights, you can align your designs and plans to better compete in the market.
Offering
What's included
TechInsights’ Connected Computing Devices provides a comprehensive view of the tablet and notebook PC markets. We track and analyze adoption and use cases for tablets and notebook PCs in the home, on the move, and at work. The crucial role mobile computing plays in how companies, schools, and consumers have adapted to the COVID-19 pandemic is at the forefront of our research. We provide unmatched granularity in our coverage of vendor strategies and performance. This comprehensive perspective provides clients with the deep insights they need to participate successfully in this rapidly evolving market.
- Competitor Analysis
- Market Data
- Insight Reports
- Demand Forecasts
- Supply Analysis
- Inquiry Privileges
- Dashboard Access
Notebooks and Tablets Teardown
TechInsights' Notebooks and Tablets Teardown provides teardowns of the highest volume devices worldwide in the notebook and tablet spaces. Device selection will offer insight into multiple segments including tablets, laptops, ultra-books and 2-in-1 detachable hybrids. Sample manufacturers include: Microsoft, Apple, Lenovo, Dell, Hewlett Packard, Xiaomi.
- Competitor Analysis
- Market Data
- Insight Reports
- Demand Forecasts
- Supply Analysis
- Inquiry Privileges
TechInsights’ Connected Home Devices gives you instant access to our extensive supply-side research and analysis of the latest trends impacting the global consumer electronics market. Served through the TechInsights Platform, you can view our current and historical forecasts and market trackers, read our expert commentary, and understand the competitive landscape across a range of product categories including Flat Panel TVs, Game Consoles, Wireless Speakers, Soundbars, Set-Top Boxes, Streaming Media Players and eBook readers.
- Competitor Analysis
- Market Data
- Insight Reports
- Demand Forecasts
- Supply Analysis
- Inquiry Privileges
- Dashboard Access
Connected TV Strategies is designed to help players across the CTV ecosystem from device vendors to content owners and service providers navigate the transition from legacy TV to streaming TV. CTVS combines detailed quarterly vendor and OS share tracking of connected TV devices with deep insights into the key trends shaping the market and the implications for content owners. CTVS offers customers an objective, research-driven approach to addressing the central strategic questions facing the CTV hardware, media and entertainment industries today.
- Competitor Analysis
- Market Data
- Insight Reports
- Demand Forecasts
- Supply Analysis
- Inquiry Privileges
- Dashboard Access
TechInsights’ Smart Home Strategies tracks devices and focuses on emerging opportunities in home monitoring, energy management, and home control systems and services. After many years of market exploration and trials, digital and IP technologies are finally enabling the widespread commercial service deployments which allow consumers to control and interact with their home security, energy and management systems. Smart Home Strategies builds on TechInsights’ 40-year heritage in exploring emerging home technology, application and service opportunities and identifies the key factors for success in this next stage in the digital home’s evolution.
- Competitor Analysis
- Market Data
- Insight Reports
- Demand Forecasts
- Supply Analysis
- Inquiry Privileges
- Dashboard Access
TechInsights' Gaming Teardown is world's largest teardown library, housing an impressive collection of devices analyzed per year. Our industry-agnostic approach provides unbiased analysis to empower fact-based decision-making. Delve into the design philosophies and discover the design wins behind these innovative creations. With over 30+ teardowns conducted annually, our expertise has been relied upon by leading OEMs, semiconductor manufacturers, and component companies for more than 25 years.
- Competitor Analysis
- Market Data
- Insight Reports
- Demand Forecasts
- Supply Analysis
- Inquiry Privileges
With increasing focus on edge computing, industrial IoT, and AI, IoT modules are a key component in enabling the intercommunication of devices through the internet. TechInsights' IoT Teardowns uncover technical innovations in IoT Modules in cutting edge consumer electronics to reveal key competitive insights on market leaders. Sample manufacturers include: Gemalto, Google, Arduino, Nvidia.
- Competitor Analysis
- Market Data
- Insight Reports
- Demand Forecasts
- Supply Analysis
- Inquiry Privileges
TechInsights' Smart Home Teardown provides analyses on an assortment of products ranging from operator deployed Set-Top-Boxes and OEM media streaming devices to smart speakers, Wi-Fi routers, and surveillance cameras. Get insights on costing trends and design techniques across the smart home ecosystem. Sample manufacturers include: Amazon, Google, Roku, Apple, Samsung, Sony.
- Competitor Analysis
- Market Data
- Insight Reports
- Demand Forecasts
- Supply Analysis
- Inquiry Privileges
TechInsights' SSD Teardown represents a sampling of industry leaders in the SSD space. Uncover the driving forces behind density increases and cost reductions. Sample manufacturers include: Samsung, Micron, Intel, SK hynix, SanDisk, Toshiba.
- Competitor Analysis
- Market Data
- Insight Reports
- Demand Forecasts
- Supply Analysis
- Inquiry Privileges
Identify opportunities for process and cost optimizations with detailed analyses on state-of-the-art image sensors.
Offering
What's included
TechInsights' Device Essentials provides broad coverage of the enabling technologies and pixel architectures in use in array imagers, time-of-flight (ToF), event-driven, biometric, and other optical sensors. Tactical reporting on new solutions as they come to market is augmented by curated analyst content.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
TechInsights' Device Essentials Plus (DEP) is an extension of SEM-based Device Essentials (DEF), performed on a subset of the annual DEF targets. DEP offers thorough structural and dopant analyses using TEM, TEM-EDS, TEM-EELS, SCM/sMIM, and SIMS analytical techniques.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Process
TechInsights' Circuit Analysis includes hierarchical schematics, delivered in a highly interactive, easy-to-navigate environment including cross-probing to layout capability, of the active pixels, column readout, ADC, row control, ramp generator, and bandgap.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Circuit
TechInsights' Image Signal Processor content provides insights into the functional blocks and die utilization of stacked and standalone image signal processors. This content provides floorplan (functional) analysis of image signal processors (ISP) in applications such as smartphone, automotive imaging and optical sensing, computer/machine vision, edge AI, IoT, LiDAR, security/ surveillance, and more.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- IC Floorplan
Optimize signal integrity for in-vehicle device connectivity with visibility into how competitive wireless transceivers support the latest protocol versions with their technology and design choices.
Offering
What's included
TechInsights' IoT Connectivity SoC Transceiver Architecture coverage enables a better comparison and understanding of how design constraints and challenges are addressed for leading-edge IoT transceiver chipsets in smart home products, wearables, and routers across market leaders and disruptors over major wireless standards such as Bluetooth, Wi-Fi, NFC, UWB, and more. It includes and extends Transceiver Floorplan analyses to identify key functional blocks and the connections between them.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Circuit
TechInsights' IoT Connectivity SoC Transceiver Floorplan provides insight into competitive designs including high-level block identification, high-level process data, and manufacturing costs for leading-edge transceivers in smart home products, wearables, and routers across market leaders and disruptors over major wireless standards such as Bluetooth, Wi-Fi, NFC, UWB, and more.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- IC Floorplan
Evaluate competitiveness against fabless and foundry partnerships with in-depth market, process technology and product design analysis on market-leading SoCs.
Offering
What's included
Advanced CMOS Essentials focuses on leading-edge SoCs and the technology used to manufacture them through structural and materials analysis. It identifies differences or nuances between competing technologies and differences between process technology options from the same company. Process Analytics offers aggregated process data, helping you create visualizations and trends of company, product, and technology evolution.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Dashboard Access
- Process
AI Processor content covers hardware technologies and products from leading AI companies. It provides deep technology analysis and head-to-head product comparisons, as well as analysis of company prospects in this rapidly developing market segment. We explain which products will win designs and why. TechInsights’ AI Processor content provides a forward-looking view, helping sort through competing claims and products.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Cost Analysis
- Block Diagram
- Product Features
- High Resolution Images
- Comp Price and Lead-time Trends
- Performance Analysis
TechInsights' Packaging coverage helps you understand all aspects of advanced logic technologies, gain visibility into the competition’s historical – and anticipated – approach, and make better next-node technology choices.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Dashboard Access
- Packaging
TechInsights' SoC Design Analysis concentrates on high-volume, first-to-market SoCs from top fabless and foundry partnerships, and offers standard cell circuit extraction and layout analysis on key areas of cutting-edge SoCs. It gives insights on area and routing trade-offs and informs future design library choices. TechInsights' SoC Design analytics enable querying data, trend analysis, comparisons, and visualizations within Logic.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Dashboard Access
- Circuit
Transistor Architecture Comparison
TechInsights' Transistor Architecture Comparison coverage provides insight into the front end of line (FEOL) innovation that drives the world's most advanced technology solutions and how industry leaders deployed them (TSMC, Samsung, Intel) over the last three generations.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Dashboard Access
- Transistor Comparison
TechInsights' Transistor Characterization assists in seeing the complete picture of process technologies and DC performance (Transistor Characterization). Understand the process, see the benchmark, and spot the trends. Transistor Characterization and Process Analytics assists you in conducting trend and predictive analysis of process data and its impact on transistor characterization (DC) performance through customized visualizations.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Dashboard Access
- Performance Analysis
TechInsights' Digital Floorplan is a high-level view of SoC design quality, focusing on leading-edge APU, CPU, GPU, AI accelerator, FPGA, baseband / connectivity, VPU, advanced MCU components, plus emerging applications such as AR and vision processing SoCs.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Dashboard Access
- IC Floorplan
Get visibility into the semiconductor supply chain so you can optimize production planning to meet demand. Gain a competitive advantage by making data-driven decisions, accelerating time to market, and fostering innovation when it comes to product development.
Offering
What's included
TechInsights' CMRS Equipment Database covers market shares with annual and quarterly forecasts for these segments along with equipment demand by device type and region.
- Market Data
- Demand Forecasts
- Inquiry Privileges
- Dashboard Access
TechInsights' CMRS Forecast Pro provides critical datasets for semiconductors, silicon, packaging, designs and reticles along with semiconductor inventories, capacity and supply-demand analysis.
- Market Data
- Demand Forecasts
- Inquiry Privileges
- Dashboard Access
TechInsights' CMRS More than Moore analysis focuses on equipment markets for greater than 28nm semiconductor manufacturing. Typical segments include LED, MEMs, power, and compound semiconductors.
- Market Data
- Demand Forecasts
- Inquiry Privileges
- Dashboard Access
CSS Premium includes market intelligence data focused specifically on subsystems and components used in semiconductor and related capital equipment.
- Competitor Analysis
TechInsights' CSUBS Critical Components includes market shares and forecast data for critical components as well as additional analysis for applications, consumption by equipment type or by OEMs and fabs.
- Market Data
- Demand Forecasts
- Inquiry Privileges
- Dashboard Access
TechInsights' CSUBS Market Leader coverage include market share and forecast data for critical subsystems and components as well as equipment and chamber unit demand.
- Competitor Analysis
- Market Data
- Demand Forecasts
- Supply Analysis
- Inquiry Privileges
- Dashboard Access
TST Device Interface Board Report
TechInsights' TST Device Interface Board Report provides market sizing and share databases, forecasts, regional and application sales for DIB providers.
- Market Data
- Demand Forecasts
- Inquiry Privileges
- Dashboard Access
TechInsights' TST Probe Card Report provides market sizing and share databases, forecasts, and regional and application sales for providers.
- Market Data
- Demand Forecasts
- Inquiry Privileges
- Dashboard Access
TST Test Burn-In Socket Report
TechInsights' TST Burn-In Socket Report provides market sizing and share databases, forecasts, regional and application sales for providers.
- Market Data
- Demand Forecasts
- Inquiry Privileges
- Dashboard Access
Support new design and process requirements with an end-to-end view of NAND, DRAM, and embedded and emerging memory technologies.
Offering
What's included
TechInsights' SSD Teardown represents a sampling of industry leaders in the SSD space. Uncover the driving forces behind density increases and cost reductions. Sample manufacturers include: Samsung, Micron, Intel, SK hynix, SanDisk, Toshiba.
TechInsights’ Advanced Memory Process analysis provides an overview of chip technology, critical features, and dimensions. It provides analyst insights into technical trends and roadmaps, design technology interaction analyses, detailed explanations of process integrations, and next node predictions.
- Competitor Analysis
- Insight Reports
- Process
- Inquiry Privileges
DRAM Circuit Analysis – Full Catalog Access
Highlights circuit innovation by providing full, transistor-level analysis on leading-edge DRAM memory circuits. TechInsights’ circuit analysis allows you to study the latest design trends and discover design elements that can help drive efficiency in your manufacturing process.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Circuit
In more complex semiconductor chips, different functional blocks and the pathways that connect them are arranged for maximum efficiency and best physical fit. DRAM Floorplan analysis identifies the functional blocks, their purpose, their technology generation, and their relative cost to produce. It explores the placement of different functional blocks and resulting changes in performance.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- IC Floorplan
Focuses on the circuit schematic design of critical DRAM device metrics for a better understanding of peripheral design, functionality, structure, and layout to help accelerate R&D and fast-track the design learning curve.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Circuit
DRAM SWD and SA Transistor Characterization
Provides cross-technology and trend analysis as well as information on the performance of transistors used in DRAM through transistor characteristic analysis. Professionals from foundries, IDMs, and fabless organizations use this analysis to benchmark against competitors and to see how process differences impact performance between technologies.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Performance Analysis
Embedded and Emerging Functional and Process Analysis
TechInsights' Embedded and Emerging Functional and Process Analysis is focused on enabling understanding of all process aspects of embedded and emerging memory through dimensional, materials, architecture analysis. It also provides analyst perspectives on the above to provide insight into trends and roadmaps. Analysis may include SEM cross-sectional and bevel imaging, TEM cross-sectional with TEM EDS, technical trend/roadmap by technology element, interaction analysis, detailed explanation of process integrations and/or next node predictions.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- IC Floorplan
- Process
Embedded and Emerging Process Flow
TechInsights' Embedded and Emerging Process Flow provides insight into the manufacturing process steps, materials, and technology across leading edge embedded and emerging memory chips to help identify areas for process optimization.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Process Flow
NAND Circuit Analysis – Full Catalog Access
Highlights circuit innovation by providing full, transistor-level analysis on leading-edge NAND memory circuits. TechInsights’ circuit analysis allows you to study the latest design trends and discover design elements that can help drive efficiency in your manufacturing process.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Circuit
NAND Flash Internal Waveform Analysis Overview
TechInsights’ NAND Internal Waveform Analysis captures the specific steps, pulses, and amplitudes on select pins during program, read, and erase cycles of one flash die of a package. The content provides an innovative, cost-effective approach to delivering a subset of a waveform analysis report.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Systems
TechInsights' Process Flow Analysis provides and tabulates a listing of process steps for a better understanding of how a chip is manufactured to help identify areas for process optimization.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Process Flow
In more complex semiconductor chips, different functional blocks and the pathways that connect them are arranged for maximum efficiency and best physical fit. Floorplan analysis identifies the functional blocks, their purpose, their technology generation, and their relative cost to produce. It explores the placement of different functional blocks and resulting changes in performance.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- IC Floorplan
NAND Peripheral Design focuses on the circuit schematic design of critical NAND device metrics for a better understanding of peripheral design, functionality, structure, and layout to help accelerate R&D and fast-track the design learning curve.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Circuit
NAND Transistor Characterization
TechInsights’ NAND Transistor Characterization provides cross-technology analysis and information on the performance of transistors used in NAND devices through transistor characteristic analysis. It provides key information on competition and vendor performance with unbiased third party data.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Performance Analysis
Accelerate RFIC development and increase product differentiation by comparing design approaches from other IDMs and understanding process parameters of the competition.
Offering
What's included
Provides more insight into filter design strategies and their integration in RF front end (RFFE) SiPs to support evolving 5G demands and requirements. This content includes structural, materials, and topographical analyses of acoustic filters from highly integrated 5G RF Front End Modules and System-in-Packages (SiPs).
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- IC Floorplan
- Process
Reveals how leading manufacturers are addressing space and power challenges in RF power amplifiers (PAs), low noise amplifiers (LNAs) and RF switches found on current RF Front End Modules. Extends the analysis from the Front End Module Architecture content to reveal more detailed insight at the circuit level.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Circuit
Front End Module Architecture
Provides more insight on how leading manufacturers are shifting away from discrete components to more space efficient solutions like power amplifier modules (PAM) and transceiver antenna modules. Shows interconnectivity of the die, filters and components from highly integrated RF Front End Modules (FEMs) found on cutting-edge designs from the latest 5G handsets.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Circuit
Front End Power Management Architecture
Enables a better comparison and understanding of how design constraints for power supply management are addressed. Includes and builds on the Front End Power Management Floorplan content to provide detailed block level architecture of envelope/average power trackers and FR2 PMICs.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Circuit
Front End Power Management Floorplan
Focuses on power supply management, which is a key design challenge for RF Front End systems within market leading 5G handsets. Provides insight into competitive designs including high level block identification, high level process data and manufacturing costs for envelope/average power trackers and FR2 PMICs from recent 5G smartphone platforms and wearables.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Circuit
Provides the most detailed RF front end block diagrams (from the antennae to the RF transceiver) for flagship 5G handsets in the industry for an in-depth understanding of RF front end design. There is no black boxing, and the reports include all passives in the system, antenna tuners, filters, FEM high-level layout, pin ins/pin outs, circuit board delayering, and cross-probing between the schematic and the layout of the physical printed circuit board (PCB).
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Block Diagram
Enables the comparison of various RFIC advanced packaging implementations to gain a better understanding of how they impact RF system design. This includes aspects such as DC and RF performance pertaining to module packaging, size and thermals, and heterogeneous integration. Analysis includes SEM cross-sectional and EDS materials analyses.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Packaging
TechInsights' RFIC Process provides structural and materials analysis of transceivers and front end modules from the latest 5G handsets to reveal die structures and materials used during the manufacturing process. It includes topographical imaging and SEM/TEM cross-sectional with EDS/EELS materials analysis of the die structure.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Packaging
TechInsights' Transceiver Architecture enables a better comparison and understanding of how design constraints and challenges are addressed for leading-edge 5G and FR2 transceivers. It includes and builds on the Transceiver Floorplan content to identify key functional blocks and the connections between them.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Circuit
With increasing focus on edge computing, industrial IoT, and AI, IoT modules are a key component in enabling the intercommunication of devices through the internet. TechInsights' IoT Teardowns uncover technical innovations in IoT Modules in cutting edge consumer electronics to reveal key competitive insights on market leaders. Sample manufacturers include: Gemalto, Google, Arduino, Nvidia.
- Competitor Analysis
- Market Data
- Demand Forecasts
- Supply Analysis
- Insight Reports
- Inquiry Privileges
TechInsights' Transceiver Floorplan provides insight into competitive designs including high level block identification, high level process data and manufacturing costs for leading-edge 5G and FR2 transceivers in flagship handsets across market leaders and disruptors.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- IC Floorplan
Maintain competitiveness from both a design and manufacturing perspective with visibility into the latest innovations, process advancements, and material changes in the power semiconductor landscape.
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What's included
TechInsights' PMIC Process Analysis provides in-depth process (structural and materials) analysis of power-management devices based on bipolar-CMOS-DMOS (BCD) technology, integrated voltage regulators (IVR), and other innovative power management devices. It includes analysis of PMICs found in devices in the mobile, automotive, and other industries, and covers structures and materials using SEM, TEM, sMIM/SCM, SEM-EDS, and TEM-EDS/EELS as required. It also includes package and die images and salient features with a comparison summary.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Process
Power Essentials (GaN, SiC, Si)
TechInsights' Power Essentials provides in-depth process analysis for GaN, SiC, and Si power devices, and comprehensive coverage of device metrics and salient features. Analysis includes detailed structural and material analysis using techniques such as SEM, TEM, and SCM/sMIM, covering package and die images/X-rays, SEM planview and cross-sectional images with annotated SEM-EDS material analysis conclusions, and cross-sectional TEM images with annotated TEM-EDS/EELS analysis conclusions for GaN devices, cross-sectional and planar SCM (sMIM) analysis for Si and SiC.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Process
TechInsights' Silicon Carbide Process Flow provides in-depth process flow analysis detailing the manufacturing steps to fabricate innovative SiC power devices from wafer-in to wafer-out. Analysis includes process architecture, mask list, and integration-level process steps, layout (.GDS) decomposed into process layers, and emulated device structure, tool type as well as design rules, layer dimensions, and process assumptions.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Process Flow
- >
Use our candid insights on global economic and business conditions, trends and outlooks impacting the semiconductor industry to help you make appropriate business decisions quickly and with confidence.
Offering
What's included
The Chip Insider® is a go-to resource for senior semiconductor executives. It provides straightforward reports on current industry issues, trends, strategies, and tactics. Get insider insights on supplier-customer dynamics, corporate strategies, industry trends, challenges, projections, and historical facts, presented in a clear and informative manner.
- Insight Reports
- Inquiry Privileges
TechInsights' TCI Graphics content provides a unique view into the health of the semiconductors manufacturing ecosystem, including key performance indicators across electronics, semiconductors, and equipment supply chains with simple charts to communicate changes in the market with weekly and monthly views.
The McClean Report helps you identify how to better position your business to be competitive. You don’t have to be an expert in semiconductors to understand the broad variety of analyses and perspectives, and how The McClean Report can complement your business, and your business decision-making – not only from the technical or legal point of view but also from the geopolitical, and regional market(s) angle.
- Insight Reports
- Inquiry Privileges
Microprocessor Report Enterprise License
Microprocessor Report Enterprise License is an industry-leading weekly journal covering new Microprocessors and SoCs, providing insight into their target application and market, and differentiation from their competitive products. This will expand your access to more of the information you need to compete globally and enhance your ability to make fact-based decisions that will impact your business faster and more effectively.
- Competitor Analysis
- Insight Reports
- Inquiry Privileges
- Block Diagram
- Product Features
- High Resolution Images
Semiconductor Analytics provides weekly data visualization on semiconductor supply and demand analysis, and provides granular level sales per week and allows for quarterly and yearly comparisons.
- Competitor Analysis
- Market Data
- Insight Reports
- Demand Forecasts
- Supply Analysis
- Inquiry Privileges
- Dashboard Access
Learn what innovations are in demand and will soon be within the smartphones, tablets, and wearables landscape. Using our reports and analysis, design semiconductors with advanced process technologies, power efficiency, security enhancements, the integration of AI, and more to meet the needs of your end customers.
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What's included
TechInsights’ Emerging Device Technologies delivers fast-moving shipment tracking and sales forecasting of the key technologies powering modern smartphones and emerging classes of new devices. EDT identifies the key technologies powering smartphones right now and which will emerge in the future, such as artificial intelligence or 5G mmWave. Technology is the lens used to track device shipments and sales for individual vendors across the globe down to the country level.
- Competitor Analysis
- Market Data
- Insight Reports
- Demand Forecasts
- Supply Analysis
- Inquiry Privileges
- Dashboard Access
PriceTRAX Web for smartphones, tablets, feature phones, and wearables tracks competitor pricing strategies, country-specific and regional dynamics, price erosion, and more. View the retail value between variants of the same model to determine technology pricing trends and see current competitor retail prices with a full history dating back to 2010. Designed for responsiveness, PriceTRAX Smartphone dashboards include bundle pricing analytics, device-only prices, and spec/price analytics.
- Competitor Analysis
- Market Data
- Inquiry Privileges
- Dashboard Access
Smartphone Country Share Tracker
TechInsights’ Smartphone Country Share Tracker gives you timely, super-detailed tracking of smartphone brand shipments and market share by country, operator, and global best-selling models.
- Competitor Analysis
- Market Data
- Insight Reports
- Inquiry Privileges
- Dashboard Access
SpecTRAX tracks new model announcements and complete hardware specification profiles for over 50,000 smartphones, tablets, feature phones, and wearables. It breaks down products into more than 350 standardized attributes for data that is exportable and ready to analyze. You’ll also get access to product availability from mobile operators and retailers, tracked across over 50 countries.
- Competitor Analysis
- Market Data
- Supply Analysis
- Inquiry Privileges
- Dashboard Access
TechInsights' Telecom Strategies gives you a first look at the telecom semiconductor value chain. We dive deep into Industry 4.0, future networks, edge platforms, and trends in communications and networking markets. Get competitive intel, market sizing, and forecasts across different technology sectors, all driven by the increasing demand for high-bandwidth, ultra-low-latency communication networks and services.
- Competitor Analysis
- Market Data
- Insight Reports
- Demand Forecasts
- Supply Analysis
- Inquiry Privileges
- Dashboard Access
Wireless Smartphone Strategies
TechInsights’ Wireless Smartphone Strategies provides comprehensive coverage of the smartphone industry. WSS is a global handset and smartphone tracker by volume, value with price-tier, and value share / profitability as key differentiators. Granular OEM forecasts for the next 4 quarters and country-level smartphone forecast data for the next 5 years are provided.
- Competitor Analysis
- Market Data
- Insight Reports
- Demand Forecasts
- Supply Analysis
- Inquiry Privileges
- Dashboard Access
TechInsights’ Wearable Device Ecosystem gives you timely, super-detailed tracking of wearable device shipments and market share on a global, regional, and country basis for top-selling vendors such as Apple Watch or Xiaomi Mi Buds. It also delivers a deep dive into the high-growth wearables market. WDE tracks and forecasts wearables markets by size, market share and price.
- Competitor Analysis
- Market Data
- Insight Reports
- Demand Forecasts
- Supply Analysis
- Inquiry Privileges
- Dashboard Access
TechInsights' Wearables Teardown covers personal health and fitness wearable systems, smartwatches, virtual reality (VR) headsets, hearables, and action cameras. Sample manufacturers include: Fitbit, Garmin, Samsung, LG, Apple, Huawei, Sony, Xiaomi.
- Competitor Analysis
- Market Data
- Supply Analysis
- Cost Analysis
- Block Diagram
- Product Features
- High Resolution Images
- Inquiry Privileges
Notebooks and Tablets Teardown
TechInsights' Notebooks and Tablets Teardown provides teardowns of the highest volume devices worldwide in the notebook and tablet spaces. Device selection will offer insight into multiple segments including tablets, laptops, ultra-books and 2-in-1 detachable hybrids. Sample manufacturers include: Microsoft, Apple, Lenovo, Dell, Hewlett Packard, Xiaomi.
- Competitor Analysis
- Market Data
- Supply Analysis
- Cost Analysis
- Block Diagram
- Product Features
- High Resolution Images
- Inquiry Privileges
TechInsights' Mobile Teardowns include smartphones and tablets as well as a wide selection of devices from a variety of major geographical centers. Sample manufacturers include: Apple, HTC, Huawei, Samsung, Xiaomi, Lenovo, LG, Sony, Nokia, Oppo, Vivo.
- Competitor Analysis
- Market Data
- Supply Analysis
- Cost Analysis
- Block Diagram
- Product Features
- High Resolution Images
- Inquiry Privileges
