An advanced floorplan analysis of the image signal processor (ISP) die from the OmniVision OV50H ISP, 1/1.3”, 50 MP, 1.2 µm Pixel Pitch Stacked Back-Illuminated PureCel®Plus-S CMOS Image Sensor with Quad Phase Detection (QPD) Autofocus Technology was extracted from the Xiaomi 14 Pro rear camera.
Advanced Packaging Outlook 2027: Five Trends Reshaping CoWoS, HBM and Chiplets
Advanced packaging will cap semiconductor growth in 2027. Explore how CoWoS, HBM4 and chiplets are reshaping capacity, yields and supply-chain strategy for AI accelerators.
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Chip Observer | Semiconductor Industry Briefing — October 2026
October’s semiconductor briefing: Apple’s first 2 nm iPhone chip, AI infrastructure and memory demand, foundry expansion, and major industry deals.
