Intel Core Meteor Lake Chiplet Package Advanced Packaging Essentials
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The Core Ultra 7 155H is a desktop processor leveraging a disaggregated chiplet design strategy and Intel’s Foveros advanced packaging technology. The package incorporates four active chiplets (tiles) mounted to a passive interposer (base tile) using micro-bump interconnect. The active tiles comprise graphics, system-on-chip (SoC), and input/output (I/O) functions fabricated by TSMC, and a single compute tile fabricated by Intel on the Intel 4 process. The base tile is also Intel fabricated. This report analyzes the complete advanced package and provides detailed analysis and costing for all chiplets.
