Insight on the structure and materials used in the manufacture of the GigaDevice HUANGSHAN4G G3 2 Gb DDR3L SDRAM die. The report includes a summary of key findings, and a detailed look at the array and peripheral structures, and materials used. SEM, TEM and materials analysis provide a complete look at how this device was manufactured.
Maximize Wafer Efficiency with TechInsights’ Die Calculator
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Earth Day 2025: A Progress Report on Sustainable Semiconductor Manufacturing
Can the chip industry scale innovation and sustainability? Discover the current state of green tech in one of the world’s most energy-intensive sectors.
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