Analysis of the process flow and integration used in the manufacture of the AMD Ryzen 9 7950X3D compute die (CCD), built using TSMC's N5 HPC FinFET process. The spreadsheet lists the hundreds of process flow steps required in its manufacture.
Advanced Packaging Outlook 2027: Five Trends Reshaping CoWoS, HBM and Chiplets
Advanced packaging will cap semiconductor growth in 2027. Explore how CoWoS, HBM4 and chiplets are reshaping capacity, yields and supply-chain strategy for AI accelerators.
CXL Memory Pooling: Why Samsung & SK hynix Are Racing
CXL memory pooling has hit production. Here’s why Samsung and SK hynix’s OCP 2026 moves on agentic AI’s KV cache matter more than raw memory capacity.
Chip Observer | Semiconductor Industry Briefing — October 2026
October’s semiconductor briefing: Apple’s first 2 nm iPhone chip, AI infrastructure and memory demand, foundry expansion, and major industry deals.
