Featured Report Analysis
Deep Dive Teardown of the Amazon Echo Show 8 3rd Gen R855D6 Smart Display
The design wins for the Amazon Echo Show 8 3rd Gen is divided between different manufacturers. The application processor comes from Amlogic while WiFi Front-end comes from Mediatek. As for the memory, SK Hynix provided 2 GB LPDDR4 SDRAM and Samsung provided 8 GB MLC NAND flash.
GalaxyCore GC32E1 Standard Floorplan Analysis
The ISP from the periphery region of the Galaxycore GC32E1, a back-illuminated (BI) CMOS Image Sensor (CIS) for mobile cameras, was extracted from the Tecno Spark 20 front camera.
Canon LI5030SAC Device Essentials Folder
The Canon LI5030SAC is a Bayer color, 6.4 μm, front-illuminated (FI) charge domain global shutter (GS) full frame (FF) CIS for machine vision applications, acquired as a standalone part.
Survey Plus Teardown of the Samsung A35 5G SM-A356E/DS Smartphone
The Samsung A35 5G is equipped with the Samsung Exynos 1380 processor, while its predecessor, the Samsung A34, offers the Mediatek Dimensity 1080. The Samsung A35 5G offers 6, 8, and 12 GB of RAM, while the Samsung A34 5G can be equipped with 4, 6, or 8 GB RAM.
Q1 2024: Honor: Topped China and Solid Progress in Overseas Market
Driven by the growth in both overseas and China market, Honor’s global smartphone shipment increased 34% YoY to 17.0 million units. It also took the leadership in China this quarter. Solid progress in overseas markets has been made with record higher contribution this quarter since the split from Huawei. Despite a slight fall on average selling price (ASP), Honor posted significant annual revenue growth in Q1 2024.
Samsung K9AHGD8J0C 133L 512 Gb TLC 3D NAND Memory Floorplan Analysis
Analysis of the floorplan design used in the SAMSUNG K9AHGD8J0C (V9 PRIME Die) 133L 512 Gb TLC 3D NAND and includes an executive summary and supporting image sets optical, X-ray, SEM cross sectional, and SEM bevel imaging sets. Process node and foundry identification, critical dimensions, memory and periphery functional block summaries and die/package cost analysis are provided.
Towering Memory: HBM and Verticality
The artificial intelligence (AI) arms race continues with key players AMD and Nvidia announcing competing products. The scale of deployments continues to expand, and the volume of required hardware is straining the supply chain and spurring new investments in advanced packaging production capacity.
Embedded Memories in PMICs – ReRAM and SONOS Memory Observations in Recently Analyzed Devices
Exploratory analysis results of a first ReRAM observations in a PMIC device: STMicroelectronics’ STWLC38 wireless charging receiver IC, including the process node and process type determination and a first look of the ReRAM structure.
Deep Dive Teardown of the Meta Quest 3 S3A VR Headset
Compared to the previous generation VR headset, the Oculus Quest 2, the Meta Quest 3 features upgraded hardware components. This includes a more powerful processor for improved performance, enhanced display technology for better visual fidelity, and upgraded tracking sensors for more accurate motion tracking.
Embedded & Emerging Memory Technology Roadmap – May 2024
The Memory Embedded and Emerging memory technology roadmap has been updated. Recently, industry leading emerging memory players such as TSMC, GlobalFoundries, Samsung, UMC, Fujitsu, Sony, Renesas, Everspin, and Avalanche introduced and revealed commercial STT-MRAM and ReRAM products used for the embedded memory applications.
Deep Dive Teardown of the Quectel CC660D-LS Wireless Module
The Quectel CC660D-LS is mainly based on MediaTek’s MT6825A. The CC660D-LS module offers versatile connectivity options, including L-band, S-band, and Band 23 connections. In addition, the module supports 3GPP Release 17 IoT non-terrestrial network (IoT-NTN) connections.
Deep Dive Teardown of the 2023 Cadillac Lyriq Front Camera
This is a Deep Dive Teardown of the Cadillac Lyriq front camera designed by ZF AG. The front camera is a part of the Cadillac Lyric safety and driver assistance system.
Automotive Sensor Demand Forecast 2022 to 2031: Lower Growth but Safety Drives Demand
The demand for automotive sensors will grow at 3.8% CAAGR in dollar terms between 2023 and 2028, at a slower pace than in the April 2023 forecast as consumer sentiment for vehicle purchasing has fallen after the “cost of living crisis.” The report also highlights growth opportunities, such as in safety applications, and demand trends for sensors in OEM factory-fitted automotive electronic systems in vehicle production.
Tracker: United Kingdom Smartphone Shipments & Marketshare by Model: Q1 2024
The United Kingdom is Western Europe's second largest smartphone market. It delivers high volume and revenue to device makers, component suppliers, and operators. Our extensive report shows the top-50 best-selling smartphone models in the UK in the first quarter of 2024. Besides popular Apple and Samsung flagships, which brands and models have made their way into the bestsellers and what is the secret behind their success?
NAND Technology Roadmap
The Memory 3D NAND technology roadmap has been updated. Industry leading 3D NAND companies such as Samsung, SK hynix, Micron, Solidigm, KIOXIA, Western Digital, YMTC, and MXIC have their own plan for the future of high-speed and high-density storage applications. Upcoming new and advanced 3D NAND technologies including multi-stacking, hybrid bonding, and package solutions are also described on the roadmap.
Q1 2024 – Xiaomi: Solid Growth in Emerging Markets
Xiaomi posted the annual smartphone volume growth for three quarters in row in Q1 2024, outpacing the global market with a 34% YoY growth rate. The robust momentum in India and emerging markets primarily led to the solid growth. However, increasing macroeconomic uncertainties, heightened competition, and potential inventory correction would cap the future growth.
Analysis: Semi capacity in China to grow 40% in next 5 years
TechInsights compiled information on semiconductor fab capacity in China (including Chinese-owned and multinational-owned fabs). Semiconductor production capacity in China expected to grow by 40% in next five years, mainly concentrated in 12-inch fabs and mature nodes.
Japan Handset Vendor Marketshare by Operator: Q1 2024
Japan handset shipments declined by -6% annually in Q1 2024. As usual, Apple continued to capture top positions through all local Japanese operators including Rakuten Mobile. Our extensive report has tracked the major handset vendors' marketshare by quarter at all major operators in Japan, including NTT Docomo, Softbank and KDDI from Q1 2012, and we started to track Rakuten Mobile, a new MNO launching the services since Q2 2020.