Automotive

Chip Insider

The Chip Insider is a go-to resource for senior semiconductor executives. It provides straightforward reports on current industry issues, trends, strategies, and tactics. Get insider insights on supplier-customer dynamics, corporate strategies, industry trends, challenges, projections, and historical facts, presented in a clear and informative manner.

• Inquiry Privileges
• Insight Reports

McClean Report

The McClean Report helps you identify how to better position your business to be competitive. You don’t have to be an expert in semiconductors to understand the broad variety of analyses and perspectives, and how The McClean Report can complement your business, and your business decision-making – not only from the technical or legal point of view but also from the geopolitical, and regional market(s) angle.

• Inquiry Privileges
• Insight Reports

Microprocessor Report

Microprocessor Report is an industry-leading weekly journal covering new Microprocessors and SoCs, providing insight into their target application and market, and differentiation from their competitive products. This will expand your access to more of the information you need to compete globally and enhance your ability to make fact-based decisions that will impact your business faster and more effectively.

• Block Diagram
• Component Price and Lead-time Trends
• Competitor Analysis
• EE Component Usage Across Products
• High Resolution Images
• IC Floorplan
• Inquiry Privileges
• Insight Reports
• Packaging
• Performance Analysis
• Process
• Product Features

Semiconductor Analytics

Semiconductor Analytics provides weekly data visualization on semiconductor supply and demand analysis, and provides granular level sales per week and allows for quarterly and yearly comparisons.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis

Semiconductor Industry Performance

TechInsights' Semiconductor Industry Performance content provides a unique view into the health of the semiconductor manufacturing ecosystem, including key performance indicators across electronics, semiconductor, and equipment supply chains with simple charts to communicate changes in the market with weekly and monthly views.

Autonomous Vehicles

Autonomous Vehicles coverage offers forecasts and analysis both of today’s ADAS technologies as well as an expert, independent view on what the future of automated driving will bring, and where the resulting opportunities will lie. It includes deep coverage at the system, semiconductor and sensor levels, as well as a broad view of whole value chain.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis

Electric Vehicles

Electric Vehicles coverage offers forecasts and analysis of the rapidly-growing and strategically vital electric vehicle market. It offers deep analyses at the system, semiconductor, and sensor levels, as well as a broad view of the whole value chain, along with valuable insights covering global and regional regulatory and policy dynamics, OEM strategies, emerging technologies, and economies.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis

Infotainment and Telematics

Automotive Infotainment and Telematics covers all key aspects of in-vehicle infotainment, wireless communication, and connectivity adoption in the connected car. It includes detailed semiconductor and system market sizing, including unit, revenues and ASPs, along with granular Tier 1 and semiconductor supplier market shares. It also looks at software trends, including OS usage, and OTA implementations.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis

Powertrain Body Chassis Safety

Powertrain, Body, Chassis and Safety is the industry’s premier source of market information on the complex global automotive electronics market. It covers over 100 different automotive electronics systems, including the resulting semiconductor and sensor demand. It also assesses the impact of vehicle architecture change on the automotive ecosystem.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis

Automotive Semiconductors

The Automotive coverage area integrates analytics from both the demand perspective of the automotive sector and the supply dynamics of semiconductors. The demand forecast tracks the dominant automotive semiconductor components such as processors, power, memory, DSPs, ASICs, image sensors, optoelectronics, among others. Additionally, the analysis provides a examination of market shares and financial profiles for top-tier automotive semiconductor firms, as well as the production capabilities of the foremost Integrated Device Manufacturers (IDMs).

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis

ADAS Controller Teardown

ADAS Controller Teardown provides curated data with technical insight on ADAS to reveal design wins and provide valuable context on how individual components contribute to the larger picture. They include:

• ICs identification and costing
• Reports containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas
• Die photos for major ICs and tables for features descriptions and dimensional data
• Costed bill of materials (BOM) spreadsheets
• RF block diagrams
• System block diagrams

• Block Diagram
• Competitor Analysis
• Cost Analysis
• High Resolution Images
• Inquiry Privileges
• Product Features

ADAS Design Material and Assembly Teardown

ADAS Design Material and Assembly provides detailed teardown photos and annotations describing assembly techniques, material function, material composition, IC selection and mechanical features of modules to help OEMs reach mass market deployments quickly and cost-effectively. It also includes:

• Isometric views of the products with dimensions and callouts of major mechanical or other visible features contributing to specific functions
• Images of subassemblies and their major components
• Weights and dimensional attributes of key components
• Materials, fabrication processes, assembly processes and features, PCB dimensions and fabrication details*
• Surface treatments*
• Thermal solutions
• Environmental/EMI (electromagnetic interference) and EMC (electromagnetic compatibility) seals
• IC selection

* = Where identifiable

• Block Diagram
• Competitor Analysis
• Cost Analysis
• High Resolution Images
• Inquiry Privileges
• Product Features

Audio Amplifier Teardown

Audio Amplifier Teardown provides curated data with technical insight on audio amplifiers to reveal design wins and provides valuable context on how individual components contribute to the larger picture. They include:

• ICs identification and costing
• Reports containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas
• Die photos for major ICs and tables for feature descriptions and dimensional data
• Costed bill of materials (BOM) spreadsheets
• RF block diagrams
• System block diagrams

• Block Diagram
• Competitor Analysis
• Cost Analysis
• High Resolution Images
• Inquiry Privileges
• Product Features

Camera Teardown

Camera Teardown provides curated data with technical insight on cameras to reveal design wins and provide valuable context on how individual components contribute to the larger picture. They include:

• ICs identification and costing
• Reports containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas
• Die photos for major ICs and tables for feature descriptions and dimensional data
• Costed bill of materials (BOM) spreadsheets
• RF block diagrams
• System block diagrams

• Block Diagram
• Competitor Analysis
• Cost Analysis
• High Resolution Images
• Inquiry Privileges
• Product Features

Infotainment Teardown

Infotainment Teardown provides curated data with technical insight on infotainment to reveal design wins and provides valuable context how individual components contribute to the larger picture. They include:

• ICs identification and costing
• Reports containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas
• Die photos for major ICs and tables for feature descriptions and dimensional data
• Costed bill of materials (BOM) spreadsheets
• RF block diagrams
• System block diagrams

• Block Diagram
• Competitor Analysis
• Cost Analysis
• High Resolution Images
• Inquiry Privileges
• Product Features

LiDAR Design Material and Assembly Teardown

LiDAR Design Material and Assembly provides detailed teardown photos and annotations describing assembly techniques, material function, material composition, IC selection and mechanical features of modules to help OEMs reach mass market deployments quickly and cost-effectively.

• Block Diagram
• Competitor Analysis
• Cost Analysis
• High Resolution Images
• Inquiry Privileges
• Product Features

LiDAR Teardown

LiDAR Teardown provides curated data with technical insight on LiDAR to reveal design wins and provides valuable context how individual components contribute to the larger picture. They include:

• ICs identification and costing
• Reports containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas
• Die photos for major ICs and tables for feature descriptions and dimensional data
• Costed bill of materials (BOM) spreadsheets
• RF block diagrams
• System block diagrams

• Block Diagram
• Competitor Analysis
• Cost Analysis
• High Resolution Images
• Inquiry Privileges
• Product Features

Automotive IC Win Database

The Automotive IC Design Win Database provides access to design wins from 500+ automotive products from 25+ tier 1 suppliers and 10 OEMs.

• Block Diagram
• Cost Analysis
• Demand Forecasts
• High Resolution Images
• Inquiry Privileges
• Insight Reports
• Market Data
• Product Features

IC Cost and Price Model

The IC Cost and Price Model includes wafer fabrication, test and packaging costs, coverage of technologies from 100mm to 300mm wafers, semiconductor manufacturing cost and selling price estimates, and cost and price by volume from 2015 to 2030. It enables users to easily estimate the cost and selling price of low-power silicon ICs.

• Data Visualisation
• Inquiry Privileges

Strategic Cost and Price Model

The Strategic Cost and Price Model includes cost and price for leading-edge 300mm wafer processes, technology roadmaps for 3D NAND, DRAM, and Logic, equipment and materials requirements, and cost and price by process, volume, and date from 2000 to 2035. It enables users to explore past, current, and future technologies from three leading producers in four segments.

• Data Visualisation
• Inquiry Privileges

Discrete and Power Cost and Price Model

The Discrete and Power Products Cost and Price Model includes wafer fabrication, test, and packaging costs, coverage of 100mm to 300mm wafer sizes, semiconductor manufacturing cost and selling price estimates, and cost and price by volume from 2015 to 2030. It enables users to easily estimate cost and selling price of high-power silicon and compound semiconductor ICs and discrete devices.

• Data Visualisation
• Inquiry Privileges

Assembly and Test Cost and Price Model

The Assembly and Test Cost and Price Model includes cost and price for assembly and test of semiconductors, unit cost and price, materials and equipment requirements, and cost and price by process, volume, and date from 2010 to 2035. It enables users to easily estimate the manufacturing cost and selling price of most IC testing and assembly operations.

• Data Visualisation
• Inquiry Privileges

Fab Database

The Fab Database includes details of location, key dates, partners, capital investment, incentives, nodes, products, capacity, and several analysis graphs of capacity by product, company, country and more.

• Competitor Analysis
• Data Visualisation
• Inquiry Privileges
• Market Data
• Product Features

Component Price Analyzer (CPA)

Gain access to this interactive tool that analyzes customers' electronic component BOMs by comparing entered prices with market prices for their specific product volume.

• Comp Price and Lead Time Trends
• Competitor Analysis
• Cost Analysis
• Data Visualisation
• Demand Forecasts
• EE Component Usage Across Products
• Inquiry Privileges
• Insight Reports
• Market Data
• Product Features

Component Price Landscape (CPL)

The leading index for tracking pricing and lead-time trends of electronic components. This solution provides benchmarking and forecast data for over 50,000 MPNs, designed for supply chain, commodity, and category managers focused on optimizing component supply.

• Comp Price and Lead Time Trends
• Competitor Analysis
• Cost Analysis
• Data Visualisation
• Demand Forecasts
• EE Component Usage Across Products
• Inquiry Privileges
• Insight Reports
• Market Data
• Product Features

AI Processor Service

AI Processor content covers hardware technologies and products from leading AI companies. It provides deep technology analysis and head-to-head product comparisons, as well as analysis of company prospects in this rapidly developing market segment. We explain which products will win designs and why. TechInsights’ AI Processor content provides a forward-looking view, helping sort through competing claims and products.

• Block Diagram
• Component Price and Lead-time Trends
• Competitor Analysis
• Cost Analysis
• High Resolution Images
• Inquiry Privileges
• Insight Reports
• Performance Analysis
• Product Features

Advanced Packaging

Advanced Packaging coverage helps you understand all aspects of advanced logic technologies, gain visibility into the competition’s historical – and anticipated – approach, and make better next-node technology choices.

• Competitor Analysis
• Data Visualisation
• Inquiry Privileges
• Insight Reports
• Packaging

Semiconductor Manufacturing Drivers

Semiconductor Manufacturing Drivers provide critical datasets for semiconductors, silicon, packaging, designs and reticles along with semiconductor inventories, capacity and supply-demand analysis.

• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Market Data

Chiplet

Our Chiplets coverage tracks usage across 33 end markets and provides a breakdown of chip market research total addressable market (TAM) split between monolithic and chiplet, enabling customers to better understand the market opportunity for advanced packaging alternatives such as chiplets and to better target the highest potential TAM opportunities.

• Block Diagram
• Competitor Analysis
• Cost Analysis
• Demand Forecasts
• EE Component Usage Across Products
• Inquiry Privileges
• Market Data
• Supply Analysis
• Product Features

Circuit Analysis

Circuit Analysis includes hierarchical schematics, delivered in a highly interactive, easy-to-navigate environment including cross-probing to layout capability, of the active pixels, column readout, ADC, row control, ramp generator, and bandgap.

• Circuit
• Competitor Analysis
• Inquiry Privileges
• Insight Reports

Device Essentials

Device Essentials provides broad coverage of the enabling technologies and pixel architectures in use in array imagers, time-of-flight (ToF), event-driven, biometric, and other optical sensors. Tactical reporting on new solutions as they come to market is augmented by curated analyst content.

• Competitor Analysis
• Inquiry Privileges
• Insight Reports
• Packaging
• Process

Digital Floorplan

Digital Floorplan is a high-level view of SoC design quality, focusing on leading-edge APU, CPU, GPU, AI accelerator, FPGA, baseband / connectivity, VPU, advanced MCU components, plus emerging applications such as AR and vision processing SoCs.

• Competitor Analysis
• Data Visualisation
• IC Floorplan
• Inquiry Privileges
• Insight Reports

Image Signal Processor

Image Signal Processor content provides insights into the functional blocks and die utilization of stacked and standalone image signal processors. This content provides floorplan (functional) analysis of image signal processors (ISP) in applications such as smartphone, automotive imaging and optical sensing, computer/machine vision, edge AI, IoT, LiDAR, security/ surveillance, and more.

• Competitor Analysis
• IC Floorplan
• Inquiry Privileges
• Insight Reports

Power Essentials (GaN, SiC, Si)

Power Essentials provides in-depth process analysis for GaN, SiC, and Si power devices, and comprehensive coverage of device metrics and salient features. Analysis includes detailed structural and material analysis using techniques such as SEM, TEM, and SCM/sMIM, covering package and die images/X-rays, SEM planview and cross-sectional images with annotated SEM-EDS material analysis conclusions, and cross-sectional TEM images with annotated TEM-EDS/EELS analysis conclusions for GaN devices, cross-sectional and planar SCM (sMIM) analysis for Si and SiC.

• Competitor Analysis
• Inquiry Privileges
• Insight Reports
• Process

Power Semiconductor - Silicon Carbide (SiC) Process Flow - 01

Silicon Carbide Process Flow provides in-depth process flow analysis detailing the manufacturing steps to fabricate innovative SiC power devices from wafer-in to wafer-out. Analysis includes process architecture, mask list, and integration-level process steps, layout (.GDS) decomposed into process layers, and emulated device structure, tool type as well as design rules, layer dimensions, and process assumptions.

• Competitor Analysis
• Inquiry Privileges
• Insight Reports
• Process Flow

RFIC Packaging

Enables the comparison of various RFIC advanced packaging implementations to gain a better understanding of how they impact RF system design. This includes aspects such as DC and RF performance pertaining to module packaging, size and thermals, and heterogeneous integration. Analysis includes SEM cross-sectional and EDS materials analyses.

• Block Diagram
• High Resolution Images
• Packaging

SoC Markets

For Fabless, IDM Semiconductor, IP vendors, and Foundries, SoC Markets explains how to optimize design costs for intricate SoCs. Understanding which chip designs and applications are driving market growth allow these companies to validate licensing and royalty revenues. With Reverse Engineering, market presence and technical performance are verified with continuous finetuning of existing models.

• Block Diagram
• Competitor Analysis
• Cost Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis
• Product Features

Transceiver Architecture - Mobile RF

Transceiver Architecture enables a better comparison and understanding of how design constraints and challenges are addressed for leading-edge 5G and FR2 transceivers. It includes and builds on the Transceiver Floorplan content to identify key functional blocks and the connections between them.

• Circuit
• Competitor Analysis
• Inquiry Privileges
• Insight Reports

Transceiver Floorplan

IoT Connectivity SoC Transceiver Floorplan provides insight into competitive designs including high-level block identification, high-level process data, and manufacturing costs for leading-edge transceivers in smart home products, wearables, and routers across market leaders and disruptors over major wireless standards such as Bluetooth, Wi-Fi, NFC, UWB, and more.

• Competitor Analysis
• IC Floorplan
• Inquiry Privileges
• Insight Reports

Transceiver Architecture - IoT Connectivity SoC

IoT Connectivity SoC Transceiver Architecture coverage enables a better comparison and understanding of how design constraints and challenges are addressed for leading-edge IoT transceiver chipsets in smart home products, wearables, and routers across market leaders and disruptors over major wireless standards such as Bluetooth, Wi-Fi, NFC, UWB, and more. It includes and extends Transceiver Floorplan analyses to identify key functional blocks and the connections between them.

• Circuit
• Competitor Analysis
• Inquiry Privileges
• Insight Reports

Transceiver Basic Floorplan

Transceiver Basic Floorplan targets the most innovative IoT SoC devices to provide key information on die utilization, block sizes and functionality, die cost and more, to better understand the core functions of the SoC chip.

• Competitor Analysis
• IC Floorplan
• Inquiry Privileges
• Insight Reports

IC Cost and Price Model

The IC Cost and Price Model includes wafer fabrication, test and packaging costs, coverage of technologies from 100mm to 300mm wafers, semiconductor manufacturing cost and selling price estimates, and cost and price by volume from 2015 to 2030. It enables users to easily estimate the cost and selling price of low-power silicon ICs.

• Data Visualisation
• Inquiry Privileges

Autonomous Vehicles

Autonomous Vehicles coverage offers forecasts and analysis both of today’s ADAS technologies as well as an expert, independent view on what the future of automated driving will bring, and where the resulting opportunities will lie. It includes deep coverage at the system, semiconductor and sensor levels, as well as a broad view of whole value chain.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis

Electric Vehicles

Electric Vehicles coverage offers forecasts and analysis of the rapidly-growing and strategically vital electric vehicle market. It offers deep analyses at the system, semiconductor, and sensor levels, as well as a broad view of the whole value chain, along with valuable insights covering global and regional regulatory and policy dynamics, OEM strategies, emerging technologies, and economies.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis

Infotainment and Telematics

Automotive Infotainment and Telematics covers all key aspects of in-vehicle infotainment, wireless communication, and connectivity adoption in the connected car. It includes detailed semiconductor and system market sizing, including unit, revenues and ASPs, along with granular Tier 1 and semiconductor supplier market shares. It also looks at software trends, including OS usage, and OTA implementations.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis

Powertrain Body Chassis Safety

Powertrain, Body, Chassis and Safety is the industry’s premier source of market information on the complex global automotive electronics market. It covers over 100 different automotive electronics systems, including the resulting semiconductor and sensor demand. It also assesses the impact of vehicle architecture change on the automotive ecosystem.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis

Automotive Vendor Landscape

Automotive Vendor Landscape provides a comprehensive view into the semiconductor suppliers serving the automotive electronics industry. Insight includes supplier profiles and the evaluation of semiconductor supply networks including production capacity and lead times. This data empowers customers to negotiate pricing more effectively, mitigate supply risks, and explore alternative suppliers.

Automotive IC Win Database

The Automotive IC Design Win Database provides access to design wins from 500+ automotive products from 25+ tier 1 suppliers and 10 OEMs.

• Block Diagram
• Competitor Analysis
• Cost Analysis
• Demand Forecasts
• High Resolution Images
• Inquiry Privileges
• Insight Reports
• Market Data
• Product Features

Automotive Semiconductors

The Automotive coverage area integrates analytics from both the demand perspective of the automotive sector and the supply dynamics of semiconductors. The demand forecast tracks the dominant automotive semiconductor components such as processors, power, memory, DSPs, ASICs, image sensors, optoelectronics, among others. Additionally, the analysis provides a examination of market shares and financial profiles for top-tier automotive semiconductor firms, as well as the production capabilities of the foremost Integrated Device Manufacturers (IDMs).

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis

Strategic Cost and Price Model

The Strategic Cost and Price Model includes cost and price for leading-edge 300mm wafer processes, technology roadmaps for 3D NAND, DRAM, and Logic, equipment and materials requirements, and cost and price by process, volume, and date from 2000 to 2035. It enables users to explore past, current, and future technologies from three leading producers in four segments.

• Data Visualisation
• Inquiry Privileges

Discrete and Power Cost and Price Model

The Discrete and Power Products Cost and Price Model includes wafer fabrication, test, and packaging costs, coverage of 100mm to 300mm wafer sizes, semiconductor manufacturing cost and selling price estimates, and cost and price by volume from 2015 to 2030. It enables users to easily estimate cost and selling price of high-power silicon and compound semiconductor ICs and discrete devices.

• Data Visualisation
• Inquiry Privileges

Assembly and Test Cost and Price Model

The Assembly and Test Cost and Price Model includes cost and price for assembly and test of semiconductors, unit cost and price, materials and equipment requirements, and cost and price by process, volume, and date from 2010 to 2035. It enables users to easily estimate the manufacturing cost and selling price of most IC testing and assembly operations.

• Data Visualisation
• Inquiry Privileges

Fab Database

The Fab Database includes details of location, key dates, partners, capital investment, incentives, nodes, products, capacity, and several analysis graphs of capacity by product, company, country and more.

• Competitor Analysis
• Data Visualisation
• Inquiry Privileges
• Market Data
• Product Features

Component Price Analyzer (CPA)

Gain access to this interactive tool that analyzes customers' electronic component BOMs by comparing entered prices with market prices for their specific product volume.

• Comp Price and Lead Time Trends
• Competitor Analysis
• Cost Analysis
• Data Visualisation
• Demand Forecasts
• EE Component Usage Across Products
• Inquiry Privileges
• Insight Reports
• Market Data
• Product Features

Component Price Landscape (CPL)

The leading index for tracking pricing and lead-time trends of electronic components. This solution provides benchmarking and forecast data for over 50,000 MPNs, designed for supply chain, commodity, and category managers focused on optimizing component supply.

• Comp Price and Lead Time Trends
• Competitor Analysis
• Cost Analysis
• Data Visualisation
• Demand Forecasts
• EE Component Usage Across Products
• Inquiry Privileges
• Insight Reports
• Market Data
• Product Features