Exclusive webinar · Apple iPhone 18
Go inside the iPhone 18 Pro and Pro Max.
See what preliminary teardown evidence reveals about Apple’s 2nm A20 Pro, camera and connectivity systems, component suppliers, and device cost.
Beyond the announcement
See what is really inside.
Join TechInsights experts for an evidence-based examination of the iPhone 18 Pro and iPhone 18 Pro Max. The session will combine preliminary Quick Turn Teardown findings with semiconductor reverse engineering, component identification, early device costing, and smartphone market intelligence.
Explore the A20 Pro processor, Apple C2 modem, evolving camera and RF architectures, memory and storage configurations, semiconductor packaging, thermal management, and the component and supplier choices inside Apple’s newest Pro models.
From physical evidence to market impact.
Inside the Pro models
Explore preliminary bills of materials, architecture, semiconductor content, suppliers, and early costing.
Apple’s 2nm silicon
Examine A20 Pro process technology, packaging choices, and Apple’s custom-silicon strategy.
Cameras and connectivity
Investigate the 48MP camera, C2 modem, N1 chip, Wi-Fi 7, Bluetooth 6, and RF architecture.
Packaging and thermal design
Compare packaging, thermal management, internal layout, and integration across both models.
Cost and design wins
See where hardware cost is concentrated and identify supplier changes and potential design wins.
Memory-market pressure
Review configurations up to 2TB and the technical and economic rationale behind Apple’s choices.
Join us live
One teardown briefing.
Two times to join.
Choose the session that works for you. Every registration also includes access to the on-demand recording.
Live expert Q&A
Bring the questions the keynote did not answer.
Ask TechInsights experts about architecture, semiconductors, component suppliers, cost structures, imaging, connectivity, memory, packaging, procurement strategy, or differences between the Pro models.
Save my spot →Why TechInsights
Evidence you cannot get from the keynote.
TechInsights combines physical teardown, semiconductor reverse engineering, supplier identification, bill-of-materials analysis, device costing, and market intelligence.
Reserve your place →See how Apple engineered the iPhone 18 Pro and Pro Max, and where the two models differ internally.
Identify the most important semiconductor, camera, connectivity, memory, and packaging changes.
Understand which component suppliers may benefit from Apple’s latest design decisions.
Connect component choices with device cost, performance, efficiency, and procurement strategy.
Put Apple’s technology and sourcing decisions in the context of the premium smartphone market.
Reserve your place
Go inside Apple’s newest Pro iPhones.
Register to explore what preliminary Quick Turn Teardowns, semiconductor reverse engineering, early costing, and market intelligence reveal.
- Two times to choose from
- Expert Q&A during the broadcast
- On-demand recording sent after the event
Register free
Session 1: Americas and Europe
Can’t attend live? Register anyway and we’ll send the recording.
