This device essentials folder (DEF) presents the ams OSRAM Mira050, 1/7″ Format, 0.5MP Resolution, 2.79 µm Pixel Pitch Stacked Back-Illuminated NIR Enhanced Voltage Domain Global Shutter CMOS Image Sensor.

This report analyzes the onsemi AR0823AT which features a 1/1.8″ format, 8.3 MP resolution, 2.1 µm pixel pitch, stacked back-illuminated HDR and LFM CMOS image sensor for automotive applications.

The United States is the world's most influential smartphone market. It delivers high volume and revenue to device makers, component suppliers, and operators.

The Huawei Mate X5 is a new foldable smartphone from Huawei. It is 14.76 mm thick at the thickest part when folded and 8.82 mm thick when unfolded.

The iPhone 15 features the 64-bit ARM based Apple’s A16 Bionic APL1W10 - the hexa-core applications processor, combining two Everest high-performance cores with four Sawtooth energy-efficient cores built on a TSMC 4nm process node die (N4P).

TechInsights' Semiconductor Analytics Report

TechInsights tracked global smartphone shipments (sell in) and they increased 5% YoY in October 2023 and global smartphone sales (sell through) grew 2% YoY.

Japan handset shipments grew by 8% annually in Q3 2023. As usual, Apple continued to capture top positions through all local Japanese operators including Rakuten Mobile.

This annual update to the TechInsights Autonomous Vehicles and Sensors Market Scenarios sees a boost for the expected penetration of L3 vehicles, but a small delay to the predicted adoption of fully autonomous L4 solutions.

This report provides an analysis of the process flow and integration used in the manufacture of the onsemi NVH4L022N120M3S Automotive M3S EliteSiC 1200 V 22 mΩ N-Channel SiC Power MOSFET module.