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If Apple is hurting due to the coronavirus, its suppliers and rivals likely are too
Apple Inc’s surprise warning that it will likely fall short of this quarter’s sales target due to the coronavirus epidemic points to much pain for its chip and other suppliers as well as for rivals who also rely on China to build their products.
In 2020, 3D flash memory will be fully upgraded to 100 multi-layer stacks
How many layers can 3D flash memory stack? Just as skyscrapers cannot be piled up indefinitely, the number of layers of 3D flash memory is also limited.
Securing Smart Connected Homes with OTP NVM
The market for piracy is huge and hackers have become increasingly sophisticated even when security is implemented in hardware. The race between the aggressors and protectors is a battle without end. Smart connected home devices are increasingly
PC technology trends 2020-DRAM and Flash
新年の幕開けに、パーソナルコンピュータのハードウェア技術の動向を占う「PCテクノロジートレンド」をお届けする。
Apple Is About to Add a Third OLED Supplier
This deal has been years in the making. China's BOE Technology Group has been angling to supply Apple with OLED displays destined for iPhones since early 2017.
Huawei Mate 30 Pro 5G dismantling: sell 6399 yuan complete machine, BOM cost is only 2799 yuan
According to agency analysis, the 4G version is Huawei's first smartphone product without US parts, while the 5G version still uses some American-made components, the proportion is ...
Deep dismantling of Huawei Mate30 Pro 5G: more than 2,000 components from Japan
From the BOM table, the estimated price of the whole machine is $ 395.71, equivalent to less than 2800 yuan, of which the main control chip accounts for about 51.9% of the whole machine price.
Imaging + Sensing End-of-Year Highlights
Huawei Leads Imaging Chip Area Arms Race, Sony Wins Big with i-ToF, Emergence of Event-Driven Vision Sensors Posted: December 18, 2019 Contributing Authors: Ray Fontaine, Senior Technology Analyst Samsung, Huawei and Apple continue to push more
What’s Next For High Bandwidth Memory
Different approaches for breaking down the memory wall.
Seoul Semiconductor patent auction analysis reveals a mixed bag of assets
Seoul Semiconductor recently dipped its toes into the sales side of the patent market with an announcement that it will be auctioning off two patent packages – one at the end of this month and the other in January.
Power Integrations Scores OEM Design Win with their PowiGaN Technology
Posted: December 12, 2019 Contributing Authors: Sinjin Dixon-Warren, PhD Consumer demand for smaller form factor and higher power, plus government efficiency regulations, are driving innovation in the USB adapter market. The USB-C power delivery
Toshiba-WD Alliance 3D NAND mass production will use Samsung TCAT process
集微网消息（文/Yuna），据Impress Watch网站报道，东芝在12月8日 召开的IEDM会议上声明在3D NAND闪存量产中采用类似于三星TCAT的存储单元结构。
Developing a successful licensing program
As first published in the Patent Lawyer, Martin Bijman, Director of IP Products at TechInsights, explains how formalized assertion programs can benefit rights holders.
DRAM Scaling Challenges Grow
More nodes and alternative memories are in the works, but schedules remain murky.
Comet Lake for desktop will appear around February 2020? Intel CPU roadmap
TechInsights released a digest report titled “Intel Core i7-1065G7“ Ice Lake ”10 nm 2nd Gen Processor Analysis” on October 31st .
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