Latest Blogs and Commentary
2nm Process Comparison Webinar: Intel 18A vs Samsung SF2
Compare Intel 18A, Samsung SF2, and TSMC N2 using TechInsights teardown, yield, floorplan, and manufacturing analysis. Free webinar July 23, 2026.
Component-Level Benchmarking: What Teardown Analysis Reveals About Competitor Materials, Assembly, and Repairability Design
Learn how teardown analysis reveals what competitors actually built and the component-level costs behind those choices
Foldable OLED Market: Why Samsung Display's Flex Titanium Matters
See how Samsung Display's Flex Titanium reflects broader changes in the foldable OLED market, where materials innovation is becoming a key differentiator.
What's Inside Competing Products
See how engineering and QA teams use teardown analysis to inform better design decisions. Download the white paper.
The Carbon Calculus of Chiplets: When Modularity Meets Environmental Impact
Explore whether chiplet-based architectures are improving semiconductor sustainability through yield-complexity tradeoffs, featuring a case study on the Apple M5 Pro architecture.
The Chip Insider®– Apple’s Chip Strategy Shift
Inside G. Dan Hutcheson’s latest analysis, Apple’s $30B Broadcom deal reveals more than a supply chain strategy, highlighting the growing geopolitical importance of semiconductors and their role as a critical AI-era resource.
SK hynix H25GTD0 321-Layer (V9) 1 Tb TLC 3D NAND Process Flow Analysis
TechInsights' latest process analysis examines SK hynix's first 321-layer V9 TLC 3D NAND, revealing its architecture and structural implementation.
Q1 2026 Global Smartphone Market: Top 200 Models, Shipments, and ASP Trends
Global smartphone shipments reached 290.3 million units in Q1 2026. Explore the top 200 smartphone models, ASP trends, price band dynamics, and vendor performance from TechInsights.
Memory Technology Roadmaps: Three Segments, Three Inflection Points
Track the architectural and manufacturing advances shaping the next generation of memory with the Q3 2026 updates to the TechInsights DRAM, NAND, and Embedded & Emerging Memory Technology Roadmaps.
Semiconductor sustainability quantified
Calculate the carbon footprint of 30,000+ ICs with cradle-to-gate transparency — from die manufacturing and packaging to transportation. The only model Carbon Trust-assured for Scope 1, 2, and 3 emissions.
Why Your Carbon Strategy Needs to Shift to the Fab
Two chips, same performance, different carbon footprint. See why decision-grade carbon modeling is essential for shaping sustainable chip decisions.
Apple M5 Pro Package Analysis: TSMC's SoIC-X F2F Hybrid Bonding in Consumer Computing
TechInsights analyzes the Apple M5 Pro APL1X15 package, revealing TSMC SoIC-X F2F hybrid bonding, CPU and GPU chiplets, silicon interposer routing, and verified die costs.
The Chip Insider®– IBM’s NanoStack Transformational or just another CFET
Inside G. Dan Hutcheson’s latest analysis, NanoStack emerges as a breakthrough, as stacked architectures outperform CFET while performance, density, and scalability reshape the semiconductor roadmap.
Why the AI Memory Shortage Could Keep DRAM and NAND Prices High for Years
AI-driven demand is creating the biggest memory shortage in history. Discover why DRAM and NAND prices are expected to remain elevated through the rest of the decade.
DRAM Market Update Q2 2026: Why This Cycle Looks Different
Stronger-than-expected demand, rising AI memory requirements, evolving procurement models, and record profitability are transforming the DRAM market in ways that differ from those of previous cycles.
Inside the Apple iPhone 17: What It Reveals About the Future of Mobile Engineering
Smartphones were already among the most complex devices to design. Then Apple raised the bar again.
Inside the Apple iPhone 17 | Teardown
Unlock the engineering, integration, and cost structure behind Apple's most advanced smartphone, and the benchmark redefining the mobile category.
Beyond the Resist: Why Lithography Isn't the Real PFAS Problem in the Fab
Our latest analysis using the TechInsights Manufacturing Carbon Module reveals a striking truth: Fluorine-free photoresist is the easy part of the PFAS problem. The real, structural challenge is dry etch.