Latest Blogs and Commentary
Global xEV Systems Demand Forecast for 2022–2031
xEV production is forecast to grow at a CAAGR of 13%, with volumes reaching 59.2 million units by 2031. The corresponding xEV powertrain electronics systems demand is forecast to grow at a CAAGR of 19% from $45.6 billion in 2023 to $108.0 billion in 2028 and reach $137.2 billion by 2031.
Apple R1 SoC Advanced Packaging Analysis
This report provides deeper insight on the advanced packaging innovations used in the manufacturing of the Apple R1. The analysis includes structural and materials analysis, and critical dimensions, providing information on form factor as well as insights into the architecture attributes that may relate to performance or thermal management.
BeiDou and Tiantong Satcom: Is Huawei leading the field of Direct-to-Smartphone communications?
China’s BeiDou satellite system is not a typical GNSS system: its two-way short message and data communication capabilities are used in in the latest series of Huawei smartphones like Mate, X and Nova to provide emergency and casual Direct-To-Smartphone communication when cellular or Wi-Fi coverage is not available.
Intel FIVR gets a new inductor
Intel has continued reducing the size of their integrated voltage regulators in yet another scaling evolution step introduced in their Sapphire Rapids product.
The Largest Regional Smartphone Market is Growing Again
Smartphone shipments in Asia Pacific grew for the two consecutive quarters in Q1 2024. Shipment volumes grew 7.6% YoY to reach 146 million units. To all appearances, the three-year slump in the world’s largest regional market is over.
Global Smartphone Sales Forecast by Operating System for 88 Countries: 2007 to 2029
Global smartphone sales are expected to rise 3% YoY to 1.16 billion units in 2024. Android and Apple iOS are expected to maintain dual leadership in global smartphone market throughout the forecast period.
Introducing TSMC N3E: The Power Behind Apple's M4 SoC
In a recent teardown of the Apple iPad Pro 11-inch, TechInsights revealed details of Apple's latest silicon: the Apple M4 SoC, codenamed TMRV93, built on TSMC's advanced N3E process. This surprise release demonstrates Apple's agility in adopting cutting-edge semiconductor technologies ahead of schedule.
EU follows the US in hiking tariffs on Chinese BEVs
On Wednesday 12, June 2024, the European Commission confirmed the anticipated hike in import tariffs for Chinese battery electric vehicles (BEVs), destined to be implemented as soon as July 4th 2024. This report summarises the scope of the tariff hikes, the differences from the tariff increase imposed by the US in May of this year, and the likely implications of the increased duties on both EU and Chinese automakers.
Deep Dive Teardown of the HP Enterprise ProLiant DL360 Gen11 P52499-B21 Server
The HPE ProLiant DL360 Gen11 server, manufactured by HP Enterprise, offers scalability for various workloads. Intel is the most cost driving manufacturer. For this device Intel provided CPU Subsystems and platform controller hub.
Insight: Communications Semiconductor Market Review Q1 2024 — AI Data Center is the One Bright Spot in a Down Cycle
The communications semiconductor market faced significant challenges in Q1 2024, primarily due to inventory corrections throughout the value chain, combined with reduced capital expenditure by telecom operators and enterprises.
Zentel PSMC A3F4GH40ABF 25 nm 4 Gb DDR4 DRAM Memory Floorplan Analysis
Analysis of the floorplan design used in the Zentel A3F4GH40ABF 25 nm 4 Gb DDR4 DRAM and includes an executive summary and supporting image sets optical, X-ray, SEM cross sectional, and SEM bevel imaging sets.
Zentel PSMC A3F4GH40ABF 25 nm 4 Gb DDR4 DRAM Memory Floorplan Analysis
Analysis of the floorplan design used in the Zentel A3F4GH40ABF 25 nm 4 Gb DDR4 DRAM and includes an executive summary and supporting image sets optical, X-ray, SEM cross sectional, and SEM bevel imaging sets.
Is TSMC N3E a Major Redesign or just a Variant? - First Observations of Differences
TechInsights has torn down the recently released Apple iPad Pro 11-inch featuring Apple M4 SoC die, with markings TMRV93.
Analysis: Can Nvidia sustain the high price of its data center GPU
The premium offered by high-end AI accelerators is driving Nvidia’s margins higher. Nvidia’s GPU accelerator card products range from $4000 to $40000 for low-end to high-end products. The question on everyone’s mind is if this trend is sustainable and if so, for how long.
Device Yield, Reliability, and Performance Boost Strategies in Navitas’ NV6245C Gen 3 GaNFast with GaNSense Half-Bridge IC
TechInsights has completed the Power Essentials analysis of the Navitas Semiconductor’s Gen 3 GaN GaNFast and GaNSense Power IC NV6245C (PEG-2309-801), focusing on the low side GaN HEMT die.
Samsung Exynos 2400 Advanced Packaging Analysis
This report provides deeper insight on the advanced packaging innovations used in the manufacturing of the Samsung Exynos 2400 processor. The analysis includes structural and materials analysis, and critical dimensions, providing information on form factor as well as insights into the architecture attributes that may relate to performance or thermal management.
Complimentary – GTC 2024: How NVIDIA's Unveiling of Blackwell Paves the Way for Embedding AI in Enterprise and Industrial IoT
Nvidia has launched their groundbreaking GPU architecture Blackwell, a system designed to process complex functions in data processing, live simulations and AI workloads. Blackwell utilizes its AI foundation to allow industries across manufacturing, semiconductor production and others to thrive within the IoT landscape.
Research Bulletin – DRAM market recovery in full swing on AI demand
Newer generations of datacenter AI accelerators leverage HBM3e for performance gains, while new client SoCs integrate NPUs for local inference.