This report presents an advanced memory essentials (AME) of the Sony CXD5610GF GlobalFoundries 22FDX eMRAM, extracted from the Telit SE868SYD110T001000 global navigation satellite system (GNSS) receiver.
AI Outlook 2027: Five Trends Reshaping AI Infrastructure, Compute and Memory
Explore five trends shaping the AI market in 2027, from AI infrastructure and compute to memory, advanced packaging and semiconductor manufacturing.
Advanced Packaging Outlook 2027: Five Trends Reshaping CoWoS, HBM and Chiplets
Advanced packaging will cap semiconductor growth in 2027. Explore how CoWoS, HBM4 and chiplets are reshaping capacity, yields and supply-chain strategy for AI accelerators.
CXL Memory Pooling: Why Samsung & SK hynix Are Racing
CXL memory pooling has hit production. Here’s why Samsung and SK hynix’s OCP 2026 moves on agentic AI’s KV cache matter more than raw memory capacity.
