This report presents a digital floorplan analysis (DFR) of the AMD Navi 31 215-145000146 Graphics Processor, fabricated using the TSMC N5P FinFET HKMG CMOS Process, and extracted from the RX 7900 XTX 102-D70201-00-TW graphics card.
AI Outlook 2027: Five Trends Reshaping AI Infrastructure, Compute and Memory
Explore five trends shaping the AI market in 2027, from AI infrastructure and compute to memory, advanced packaging and semiconductor manufacturing.
Advanced Packaging Outlook 2027: Five Trends Reshaping CoWoS, HBM and Chiplets
Advanced packaging will cap semiconductor growth in 2027. Explore how CoWoS, HBM4 and chiplets are reshaping capacity, yields and supply-chain strategy for AI accelerators.
CXL Memory Pooling: Why Samsung & SK hynix Are Racing
CXL memory pooling has hit production. Here’s why Samsung and SK hynix’s OCP 2026 moves on agentic AI’s KV cache matter more than raw memory capacity.
