The Broadcom BCM88920 StrataDNX™ Ramon3 is telecommunications industry switch gear packaged in a flip-chip ball grid array (FC-BGA) style package. It has a large footprint with over 9,000 package connections and a very low die-to-package ratio. This report presents detailed delayering of the organic substrate supporting the chip, as well as die photographs and analysis.
Advanced Packaging Outlook 2027: Five Trends Reshaping CoWoS, HBM and Chiplets
Advanced packaging will cap semiconductor growth in 2027. Explore how CoWoS, HBM4 and chiplets are reshaping capacity, yields and supply-chain strategy for AI accelerators.
CXL Memory Pooling: Why Samsung & SK hynix Are Racing
CXL memory pooling has hit production. Here’s why Samsung and SK hynix’s OCP 2026 moves on agentic AI’s KV cache matter more than raw memory capacity.
Chip Observer | Semiconductor Industry Briefing — October 2026
October’s semiconductor briefing: Apple’s first 2 nm iPhone chip, AI infrastructure and memory demand, foundry expansion, and major industry deals.
