2 Min Read August 13, 2025
A Basic Floorplan Analysis of the power management IC Qualcomm HG11-27204200 die found inside the Qualcomm PM8550VE-001 component, which was extracted from the Motorola Edge+ 2023 smartphone.
Advanced Packaging Outlook 2027: Five Trends Reshaping CoWoS, HBM and Chiplets
Advanced packaging will cap semiconductor growth in 2027. Explore how CoWoS, HBM4 and chiplets are reshaping capacity, yields and supply-chain strategy for AI accelerators.
CXL Memory Pooling: Why Samsung & SK hynix Are Racing
CXL memory pooling has hit production. Here’s why Samsung and SK hynix’s OCP 2026 moves on agentic AI’s KV cache matter more than raw memory capacity.
Chip Observer | Semiconductor Industry Briefing — October 2026
October’s semiconductor briefing: Apple’s first 2 nm iPhone chip, AI infrastructure and memory demand, foundry expansion, and major industry deals.
