This report presents a Basic Package Analysis of the Texas Instrument OPA2333 semiconductor device encapsulated in Texas Instruments extreme temperature range package. The device belongs to a series of CMOS operational amplifiers using a proprietary auto-calibration technique to simultaneously provide very low offset voltage and near-zero drift over time and temperature, and optimized for low voltage single-supply operation. The OPA2333SHKJ is an eight leads’ ceramic dual flatpack (DFP) comprising a single semiconductor die with the markings IC05018. The OPA2333SHKJ is high-temperature product utilizing highly optimized silicon (die) solutions with design and process enhancements to maximize performance over extended temperatures, such as a range from -55°C to 210°C. This package analysis report includes: • Optical and X-ray photographs of the package • Scanning electron microscopy (SEM) cross-sectional images of the package • SEM-based energy dispersive spectroscopy (SEM-EDS) analysis results of the packaging material