Samsung 1a 16Gb LPDDR5X DRAM Process Full Flow Report
Share This Post
This report is a detailed process flow report with 3D emulation images in each emulated process step of the Samsung D1a nm 16Gb LPDDR5X DRAM device.
iPhone 17 Teardown Reveals Major STMicroelectronics IR Sensor Redesign
The iPhone 17 Pro Max introduces a major IR sensor redesign. See how STMicroelectronics’ new architecture reshapes biometric imaging.
Huawei Mate 80 Pro Max Teardown Confirms Kirin 9030 Pro on SMIC N+3
TechInsights’ teardown of the Huawei Mate 80 Pro Max confirms the Kirin 9030 Pro on SMIC’s N+3 process and reveals major upgrades in display, cameras, and connectivity.
2026 Advanced Packaging Outlook Report
Discover the five expectations defining advanced packaging in 2026, including CPO adoption, HBM4 demand, panel and glass scaling, 3D thermal challenges, and chiplets for mobile.
The Authoritative Information Platform to the Semiconductor Industry.
