A comparison of the recently analyzed 1YY-L quad-level cell (QLC) 3D NANDs (Samsung V7 QLC, KIOXIA/WD BiCS6 QLC, Micron Gen5 QLC and Solidigm Gen5 QLC) with YMTC Gen4 QLC 3D NAND is presented. In addition, projection of KIOXIA/WD QLC to achieve bit density of 100 Gb/mm2 for one thousand layers 3D NAND is made.
Apple A20 Pro: Inside the iPhone 18 Pro’s TSMC 2nm Processor
TechInsights analyzes Apple’s A20 Pro processor, revealing TSMC N2 gate-all-around technology, expanded AI and graphics processing, and a new side-by-side memory packaging architecture.
Apple iPhone 18 Pro Max Teardown: A20 Pro, X80 and Apple N1
See what TechInsights’ preliminary teardown reveals about the iPhone 18 Pro Max, including its A20 Pro processor, Qualcomm X80 modem, Apple N1, and new mmWave hardware.
The AI Power Paradox: Why Datacenter Emissions Are Outpacing Grid Decarbonization
Datacenter emissions are rising as AI capacity expands. See why electricity demand could outpace grid decarbonization through 2031.
