Huge up-front R&D investment requires customers to have up-to-date and accurate competitive intelligence

Our analysis quantifies the unknown to help you make informed decisions. We can determine what it will cost to bring advanced memory to market, we research potential market challenges to help you determine what your risks are, and we help define your de-risking strategy.

Provides the facts you need to make informed decisions on your biggest investments

Allows you to go to market quicker with best of class products

Empowers you to grow market share and revenue

Tailored Memory analysis to meet your needs

TechInsights Memory offerings have been developed to provide the focused technical intelligence you need based on your industry and role.

Product Brief Download

 

SSD Teardown

Includes:

  • Analysis Coverage
    • Teardown Images
    • Major ICs Design Win Table
    • Costed bill of materials
    • 25 teardown reports/year

Mobile Device Teardown

Includes:

  • Analysis Coverage
    • 60 Deep Dive Teardown reports/year
    • 130 Quick Survey Teardown reports/year
      • 75 upconverted to Survey Plus Teardown reports/year
  • Trend Analysis – 4 briefings / year on mobile device trends
  • 1 on-site analyst visit / year
 
 

DRAM Functional Analysis

Includes:

  • Analysis Coverage
    • Focused on leading-edge DRAM
    • Package photos and X-rays
    • CircuitVision optical top metal and poly die photos
    • SEM images and node assessment
    • 13-15 MFR reports/year

DRAM: Sense & SWD Transistor Characterization

Includes:

  • Analysis Coverage
    • Universal curves for IOFF vs. ION and IOFF vs. ID, LIN; Transfer and output characteristics for each universal curve data point
    • 4 Transistor Characterization reports/year
  • Trend Analysis – Regularly updated briefing
  • Upgraded on-site analyst visit / year
 
 

NAND Functional Analysis

Includes:

  • Analysis Coverage
    • Focused on leading-edge planar NAND and 3D NAND
    • Package photos and X-rays
    • CircuitVision optical top metal and poly die photos
    • SEM cross-sectional imaging and node assessment
    • 13-15 MFR reports/year

Advanced Process & Packaging

Includes:

  • Analysis Coverage
    • Package photos and X-rays
    • Optical top metal and poly die photos
    • SEM cross-sectional and bevel imaging
    • TEM cross-sectional analysis with TEM EDS
    • 7-8 Memory AME reports/year
    • 4-5 Package AME reports/year
  • Trend Analysis – 3 briefings / year
  • 1 on-site analyst visit / year
 
 

Process Flows

Requires a subscription to Process & Advanced Packaging

Includes:

  • Analysis Coverage
    • Process Flow Analysis (PFA) – Process Steps, Tool Type, Material – 8-9 reports / year
    • Process Flow Full Emulation (PFF) – 3D Emulation, Layout GDS – 5-6 reports / year
  • Enhanced on-site analyst visits with PF trends

Circuit Analysis

DRAM, NAND, Emerging

*Individual Report Purchase

Circuit analysis is not currently part of the annual subscription, but is available as custom work.

The actual scope of work will vary, and will need to be discussed with TechInsights on case by case scenario.